Global Semiconductor Industry Updates

1. The National Institute of Advanced Industrial Science and Technology of Japan, in collaboration with Honda Research Institute, has developed a prototype of a p-type diamond MOSFET and demonstrated amperage-level high-speed switching for the first time.  

2. Russia has successfully developed its first 350nm lithography machine.  

3. Micron Technology will increase the prices of its memory products by 10% to 15% starting in April.  

4. On the evening of March 26, Nvidia's stock price experienced a significant drop, with its market value evaporating by about 1.2 trillion yuan in a single day.  

5. The U.S. has added over 50 Chinese tech companies and institutions to its "Entity List," with the new restrictions expected to take effect on March 28.  

6. Over 20 back-end semiconductor manufacturing companies in Japan are forming a supplier alliance to collaborate on production and material supply, aiming to strengthen the domestic supply chain.  

China Semiconductor Industry Updates

1. A team led by Associate Professor Li Qiang from the Department of Telecommunications at Xi'an Jiaotong University has developed a boron nitride deep ultraviolet optoelectronic chip.  

2. Shangyang Software has officially launched the CIM system for its 12-inch wafer fully automated production line with specialized processes.  

3. Kinghelm/Slkor (www.slkoric.com) achieved a new sales record on March 26, with 74 transactions processed in a single day! Zhang Junjun, Director of Sales Department II at Saco Micro, secured 14 transactions and earned a 2000 yuan bonus!  

4. SMIC’s revenue for the full year of 2024 is expected to exceed 8 billion USD, maintaining its position as the second-largest pure-play foundry in the world.  

5. A spokesperson for China’s Ministry of Commerce stated that China has filed a lawsuit under the WTO dispute settlement mechanism in response to the U.S. tariff increases, and will proceed with subsequent procedures in accordance with WTO rules.  

6. TSMC’s third U.S. factory will begin construction this year, with plans to produce 2nm chips by 2030.