Global Semiconductor Industry Updates

1. Intel's promised $28 billion chip manufacturing plant investment in Ohio will face further delays. The first plant is expected to begin production in 2030 or the following year, while the second plant will be delayed until 2032.

2. Chip giant SK Hynix has decided to exit the image sensor business for smartphones and digital cameras, shifting its focus to artificial intelligence memory.

3. According to market research firm Yole Group, the global compound semiconductor device market is expected to grow to around $25 billion by 2030.

4. Foundry giants like TSMC, Samsung, and Intel, with their accumulated technology, capital, and customer resources in chip manufacturing, are making strong forays into the advanced packaging field, causing significant disruption to traditional OSAT giants.

5. Kinghelm (www.kinghelm.com.cn) and Saco Micro extend their heartfelt holiday wishes to goddesses worldwide! Slkor Semiconductor (www.slkoric.com) is working closely with the Dejie platform, resulting in continuous increases in product sales and new customers, with clients across the United States, Europe, Australia, Israel, and the Arab world, helping "Slkor" rapidly become an international brand!

6. Xiaomi Auto is one of the latest entrants into the car manufacturing space but is already among the best-selling new forces in the industry.

China Semiconductor Industry Updates

1. The 2025 government work report highlights new achievements in fields like integrated circuits, artificial intelligence, and quantum technology in 2024, and in 2025, will aim to unleash the innovation potential of the digital economy, continuing to advance the "AI+" initiative.

2. National People's Congress representative Lei Jun submitted five proposals, focusing on accelerating the mass production of autonomous vehicles, developing the smart connected new energy vehicle industry ecosystem, promoting high-quality development of AI terminal industries, optimizing new energy vehicle license plate designs, and strengthening the governance of "AI face-swapping and voice imitation" illegal infringements.

3. The 2025 government work report introduces new forms of productivity, with a focus on embodied intelligence, 6G, and large models.

4. Guangdong Hanqi Semiconductor Co., Ltd. has officially started the construction of its full-chip micro DFN/QFN packaging project, which will focus on automotive-grade chips and third-generation semiconductor packaging technology.

5. Shenzhen Huaxin Micro Measurement Technology Co., Ltd. has officially signed a contract for its semiconductor testing substrate production and R&D project, which will be located in Kunshan Qiandeng, with an initial investment of 250 million yuan.

6. The Dali City government, Dali Economic Development Zone Management Committee, and Shenzhen Foster Semiconductor Co., Ltd. have signed an investment cooperation agreement to invest 1.2 billion yuan in a new wafer plant at the Shangdeng Advanced Equipment Manufacturing Industrial Park.