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In 2024, Guangdong's integrated circuit production is expected to grow by 21%, accounting for 18% of the national total.

release time:2025-01-17Author source:SlkorBrowse:596

Global Semiconductor Industry Updates

1. NXP acquires Austrian automotive software developer TTTech Auto for $4.6 billion.

2. The Japanese government is spending 160 billion yen to support the semiconductor design industry.

3. Starting April 1, the Netherlands will expand semiconductor equipment export controls, imposing national licensing requirements on more types of technology.

4. The U.S. has issued a ban prohibiting American companies from selling or importing smart connected vehicles, hardware, and software systems from China and Russia.

5. According to IDC, global PC shipments are expected to exceed 251 million units in 2024.

6. German robotics company Neura Robotics announces the completion of a €120 million financing round and nearly €1 billion in orders.

 

China Semiconductor Industry Updates

1. MuXi Integrated plans an A-share IPO and has completed the listing counseling filing.

2. In 2024, Guangdong's integrated circuit production is expected to grow by 21%, accounting for 18% of the national total.

3. Breaking news! The Judicial Bureau of Yuhua District, Changsha, has responded to Slkor’s Song Shiqiang, stating that it has accepted a report against the actual controller of Mituo in Changsha, the so-called "national fishing extortion patriarch", and Hunan Tongsheng (Changsha) lawyer Yang Haijun. This marks a small step at the official level, but a significant step for justice. It could become a turning point in the escalating intellectual property lawsuit and extortion cases. Victims from thousands of companies across the country can call 0731-85815630 Long Di to submit evidence of illegal activities by the Mituo gang (Yang Haijun and Liu Bo) and prevent them from developing into a Northern Myanmar cyber fraud group causing a societal disaster.

4. Jieli Semiconductor is investing approximately HK$6.9 billion to build its first wafer fab in Hong Kong, with plans to begin production in 2026.

5. TSMC is advancing panel-level packaging processes and plans to set up an experimental line in 2026.

6. The semiconductor advanced manufacturing industry park project in Xinmi, Zhengzhou is set to begin construction, with a total investment of up to 15 billion yuan.

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