Global Semiconductor Industry Updates

1. Applied Materials stated that due to the impact of the US-China chip ban, the company was forced to halt equipment maintenance services for certain customers in mainland China, which could result in a $400 million revenue loss this year.

2. The White House has released a significant "America First" investment policy memo. This policy adjustment, particularly its restrictive measures on US-China two-way investment, has drawn global attention due to its magnitude and wide-reaching impact.

3. The AAC 2025 International Connectivity Technology Conference and Wire Harness World Annual Conference, themed "Connecting. Collaborating. Smart Manufacturing," will be grandly held on March 6-7, 2025, at the Shanghai International Procurement Exhibition Center.

4. The Electric Drive Transportation Association (EDTA), representing US automakers and electric vehicle charging companies, has urged the US Department of Transportation to quickly restart a $5 billion electric vehicle infrastructure program.

5. Recently, Deng Haifeng, Sales Director, and Yang Bo, Sales Manager of Kinghelm Electronics (www.kinghelm.com.cn), along with other representatives from the Shenzhen headquarters, visited the Kinghelm production base in Luozhai, Guangxi. General Manager Mr. Song Shiqiang praised their service quality and work efficiency, while also congratulating and awarding the production base for its "three joys" and "five improvements."

6. Recently, three major semiconductor projects worth hundreds of billions of RMB in Zhuhai, Kunshan, and Wuhan, China, have made significant progress.

China Semiconductor Industry Updates

1. Tongfu Microelectronics has completed the acquisition of a 26% stake in Jinglong Technology from Jingyuan Electronics for a transaction amount of 1.378 billion RMB.

2. Zhongwei Semiconductor Equipment (Shanghai) Co., Ltd. is constructing a research and development and production base, as well as a Southwest Headquarters project, with a total investment of approximately 3.05 billion RMB.

3. Huamao Composite Ceramic Refractory Integrated Recycling Project has a total investment of 2.47 billion RMB. Once the project reaches full capacity, it is expected to produce 300,000 tons of silicon carbide and related products annually.

4. Panasonic Group will invest an additional 120 million RMB to build a new semiconductor packaging materials plant, which is scheduled to break ground in Fengxian, Shanghai, in July this year.

5. Kinghelm (www.kinghelm.net)/Slkor Semiconductor Sales Manager Peng Ke completed 17 transactions in one day, and the company awarded him 2,000 RMB as a reward.

6. A chip packaging and testing project with a total investment of 5 billion RMB has officially landed in Qingshanhu Science and Technology City, Hangzhou. The project aims to achieve an annual production capacity of 6 billion chips and related components for testing and packaging.