Global Semiconductor Industry Updates

1. China plans to implement countermeasures, strengthening export restrictions on battery component manufacturing and key minerals, such as lithium and gallium processing technologies.

2. On January 3, the U.S. Department of Commerce announced that it would add 13 entities from China, Myanmar, and Pakistan to the Entity List, with the measures taking effect on January 6.

3. Jing-Cheng Lin, a renowned expert in chip packaging, announced his departure from Samsung, casting a shadow over the future development of Samsung's semiconductor business.

4. The most advanced DRAM products on the market today (D1b/β) have reached the 12-13nm technology node, with Samsung leading the way at 12.5nm.

5. The Changsha Lawyers Association responded to the fishing victim representative of Mituo Information, Slkor Semiconductor (www.slkormicro.com), stating that the law firm of Yang Haijun, the operator behind the fishing scam, reported no violations and no case would be filed! Did Yang Haijun bribe the Lawyers Association with illicit funds, or is there a protective force behind this? This clear case of cover-up will lead hundreds of thousands of victims to file complaints with the relevant authorities and publicly expose the issue to all media!

6. Broadcom’s customized ASICs, with their targeted optimizations and cost advantages, are expected to gradually capture more market share from Nvidia's GPUs.

China Semiconductor Industry Updates

1. Beijing and Shanghai's state-owned assets have jointly established the Beijing Integrated Circuit Equipment Industry Investment and Mergers & Acquisitions Phase II Fund, with a total scale of 3 billion RMB and an initial fundraising target of no more than 2.5 billion RMB.

2. The Nova Nebula MLED display ASIC control chip, as the industry’s first, is equipped with algorithms for point-by-point luminance calibration, full grayscale, multi-dimensional calibration, picture quality engine, dynamic engine, and more.

3. Xiamen-based Hengkun New Materials, a key supplier of materials for 12-inch wafer manufacturing, has received approval for its IPO on the STAR Market.

4. Taiwan Semiconductor Manufacturing Company (TSMC), the leader in chip foundry services, plans to adjust the pricing of its 3nm, 5nm advanced processes, and CoWoS packaging technologies starting in January 2025, with increases of up to 20%.

5. InnoLux (Suzhou) Technology Co., Ltd. has officially listed on the Hong Kong Stock Exchange, becoming the first company in the "third-generation semiconductor" sector to be publicly traded.

6. Shenzhen VisionSmart Storage Technology Co., Ltd. has achieved mass production of HBM2e chips and plans to complete the front-end design of the next-generation HBM3/HBM3e chips by around the 2025 Chinese New Year.