Global Semiconductor Industry Updates

1. The Ministry of Economy, Trade and Industry (METI) of Japan has added 42 Chinese entities to its export control "End User List," with the updated list taking effect on February 5th.

2. China is imposing additional tariffs on U.S. imported cars and other goods, starting from February 10th.

3. The U.S. Congress has recently introduced the "2025 U.S.-China AI Decoupling Act," which prohibits Americans from assisting China in advancing AI and bans them from downloading or using DeepSeek. Violators could face criminal charges, with penalties including up to 20 years in prison and a fine of up to $1 million.

4. In 2025, global semiconductor production capacity will grow at an annual rate of 6.6%, reaching 33.6 million wafers per month, while capacity for mainstream processes will increase by 6%, totaling 15 million wafers per month.

5. On February 5th, Kinghelm's (www.kinghelm.com.cn) sales department held its 2024 annual work summary meeting. General Manager Song Shiqiang attended the meeting, and Deputy General Manager Cheng Yujie chaired the event, delivering the 2024 work report and outlining plans for 2025. This greatly boosted the morale and cohesion of Kinghelm’s “victorious” wolf-pack team and enhanced its combat effectiveness.

6. The AI wave has sparked a surge in demand for advanced semiconductor processes, which will drive a 20% year-on-year growth in global wafer foundry output value this year.

China Semiconductor Industry Updates

1. China's State Administration for Market Regulation has initiated a formal investigation into Google, while the Ministry of Commerce has added PVH Group and Inmena Corporation to the unreliable entity list.

2. In 2024, Jiangsu province completed investments of over 730 billion yuan in 450 major provincial projects, exceeding the planned target by 13%.

3. Beijing Electric Control Integrated Circuit Manufacturing Co., Ltd. has undergone a business change, with its registered capital increasing from 10 million yuan to 20 billion yuan, a growth of 199,900%.

4. TSMC’s CoWoS capacity will grow steadily over the next five years, reaching a monthly capacity of 75,000 wafers by the end of 2025.

5. The Nanjing Kangyuan Integrated Circuit Packaging Substrate Project is about to begin production. The total investment in the project is 5 billion yuan, and it is a major project in Jiangsu Province.

6. The Changzhou Hongwei Power Semiconductor Device Project, a major project in Jiangsu Province, has reached a milestone with the successful rollout of its 1 millionth automotive-grade, dual-side heat dissipation plastic encapsulated module.