Global Semiconductor Industry Updates

1. The broad Foundry 2.0 market (which includes wafer foundry, non-memory IDM, OSAT, and photomask manufacturing) is expected to reach a market size of $298 billion by 2025, with an 11% year-over-year growth.

2. Texas Instruments (TI) has launched the world’s smallest MCU, expanding its comprehensive Arm Cortex-M0+ MSPM0 MCU product lineup.

3. STMicroelectronics (ST) has introduced the STM32WBA6 series, which supports both Bluetooth Low Energy (Bluetooth® LE) and IEEE 802.15.4 standards on a single chip.

4. Apple CEO Tim Cook praised DeepSeek for its innovations in reducing the training and operational costs of the V3 model, emphasizing that innovations that drive efficiency are always a positive thing.

5. Kinghelm Electronics (www.kinghelm.com.cn) had a remarkable performance boost in March this year. Led by Vice General Manager Cheng Yujie, the team demonstrated exceptional teamwork, achieving the first-phase goal for 2025 ahead of schedule. General Manager Song Shiqiang congratulated the company on its early success, noting that generous bonuses have been prepared for the team.

6. IDC forecasts that the global semiconductor market will grow by 15.9% in 2025, slightly slower than last year’s growth rate of 20%, but still maintaining a healthy development trend.

China Semiconductor Industry Updates

1. Ant Group has developed AI model training technology using chips made in China, reducing costs by 20%.

2. The 2025 China Semiconductor Packaging and Testing Conference will be held in Wuxi on April 16.

3. SEMICON/FPD China 2025, themed "Cross-Border Global, Heart-to-Heart Connection," is being held at the Shanghai New International Expo Centre from March 26-28.

4. NIO's ET9 will debut with the self-developed Shenji NX9031 smart driving chip.

5. Guoxin Technology hosted the mass production launch ceremony for its automotive electronics DSP chip, helping Suzhou become a hub for “Chinese chips.”

6. Shandong Jingjia Semiconductor Co., Ltd. has filed a patent for a “UV light-assisted polishing method for gallium nitride wafers.”

materials for the first time globally.