Global Semiconductor Industry Updates

1. U.S. semiconductor startup Zero ASIC has announced the launch of the world’s first open-standard eFPGAIP product, Platypus.  

2. Microchip Technology will sell its wafer manufacturing facility in Tempe, Arizona.  

3. Japanese real estate developer Mitsui Fudosan plans to build a chip-focused science park in Kumamoto Prefecture in the southwest of Japan.  

4. Cadence Design Systems has invested £2.5 million to establish a semiconductor design center in Cardiff, Wales, UK.  

5. The United Arab Emirates has committed to investing $1.4 trillion in the U.S. over the next decade, with investments spanning artificial intelligence, semiconductors, and more.  

6. Micron's Chief Business Officer has announced that all of the company’s HBM chips for 2025 have already been sold out.  

China Semiconductor Industry Updates

1. Shanghai HiSilicon has announced that its cellular chipset will soon enter mass production.  

2. Jiufengshan Lab has released China’s first 100nm silicon-based GaN commercial process design kit.  

3. Spring hiking brings joy to all! Kinghelm and Slkor (www.slkoric.com) successfully completed their first team-building event of 2025.  

4. Li Bin, CEO of NIO, stated that the company will start using its self-developed chips in the ET9, and has no plans to use Nvidia's Thor autonomous driving chips.  

5. Zhejiang University has broken the LED technology limit by successfully developing a 90nm perovskite LED.  

6. TCL has launched the world’s first AI large model for the smart lock industry.