Global Semiconductor Industry Updates

1. Samsung Electronics has started developing a 1nm (nanometer, one-billionth of a meter) wafer fabrication process.

2. German ferroelectric memory company (FMC) has formed a strategic partnership with semiconductor firm Neumonda to establish a new non-volatile memory chip (FeRAM) production line in Dresden, Germany.

3. Google has officially launched its seventh-generation TPU (Tensor Processing Unit) accelerator, “Ironwood,” designed specifically for AI, with a peak single-chip computational power of 4,614 TFLOPs.

4. Samsung Electronics' foundry division has provided Qualcomm with chip prototypes and is expected to secure chip manufacturing orders from Qualcomm for advanced processes such as 3nm.

5. Kinghelm (www.kinghelm.com.cn) / Sakowei is about to launch the VIS standardized system (Version 2504), available in both Chinese and English. It includes content such as the logo, slogan, definitions, and element combinations, which will help with the international dissemination of the “kinghelm” and “slkor” brands and reflect the company’s soft power!

6. Infineon has acquired Marvell Technology’s automotive Ethernet business for $2.5 billion in cash.

China Semiconductor Industry Updates

1. The R&D building of the 8-inch MEMS wafer production line project at the Metallurgical Division has been successfully topped out.

2. The construction of the Yaxin Microelectronics Semiconductor Wafer Manufacturing and Packaging Testing Project has officially commenced, with a total investment of 4 billion yuan.

3. Changcheng Power has incorporated Innoscience’s Gallium Nitride (InnoGaN) technology into its Titanium-level power supplies designed for AI data centers.

4. The initiation of five industry standards, including the "General Technical Requirements for Automotive Chip Certification and Review," aims to further improve the automotive chip certification and review technical system.

5. GuoXin Technology’s ultra-high-performance cloud security chip, CCP917T, based on a self-developed multi-core CPU architecture using RISC-V, has successfully passed internal testing.

6. Chengdu Sino Microelectronics Technology Co.,Ltd. has launched the multi-channel fully integrated high-performance RF direct acquisition RFFPGA.