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Revolutionary 3rd-Gen MOSFET Platform and New Chip Launched by Qingchun

release time:2025-04-23Author source:SlkorBrowse:889

Global Semiconductor Industry Updates

1. UK-based autonomous driving technology company Wayve is expanding into the Asian market by establishing a new testing and development center in Japan.

2. A team of 30 scientists from the Indian Institute of Science has submitted a proposal to the government for developing an "A-grade" chip, which is much smaller than the smallest chips currently in production.

3. Samsung plans to halt production of several DDR4 memory models by the end of 2025, with the final order date set for early June.

4. Elon Musk is entering the semiconductor packaging industry, with plans to build a 700x700mm packaging production line.

5. LG Electronics has announced that it will officially exit the electric vehicle (EV) charging station business.

6. Japanese chip manufacturing equipment supplier Tokyo Electron is setting up a base in India to design chip manufacturing tools and develop related software.

 

China Semiconductor Industry Updates

1. The International Low-Temperature Bonding 3D Integration Technology Symposium will take place in Tianjin from August 3 to 4, 2025.

2. The surge in gold prices is affecting the semiconductor industry, with major assembly and testing companies, such as Kingpak Technology and Nanmao Technology, announcing price hikes, making them the first semiconductor companies to raise prices in response to the current rise in gold prices.

3. Kinghelm (www.kinghelm.com) has successfully completed the re-assessment of its ISO9001 quality management system certification.

4. Horizon Robotics and NIO have officially launched their first collaborative model – the Firefly.

5. Gallium Semiconductor has successfully received approval to establish a post-doctoral research station in Zhejiang Province.

6. Qingchun Semiconductor has successfully launched its third-generation silicon carbide metal-oxide semiconductor field-effect transistor (MOSFET) technology platform and released its first main drive chip, the S3M008120BK.

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