Global Semiconductor Industry Updates

1. Global semiconductor capital expenditure in 2024 is projected to be $155 billion, a 5% decrease from $168 billion in 2023. It is estimated that expenditure will grow by 3% in 2025, reaching $160 billion.

2. STMicroelectronics (ST) and Hua Hong Semiconductor have reached a cooperation agreement to begin manufacturing 40nm MCU chips in China by the end of 2025.

3. According to industry research firm TrendForce, Chinese wafer foundries will become the primary driver of growth in global mature process technologies by 2025.

4. Micron's HBM3E 12H 36GB offers a 50% increase in capacity compared to the HBM3E 8H 24GB, while reducing power consumption by 20%, enabling AI computations to run more efficiently.

5. On the morning of March 28, Mr. Song Shiqiang, General Manager of Kinghelm (www.kinghelm.com.cn), hosted an "Enterprise VIS Training." The company's mid-level managers and heads of various functional departments participated. This training aims to shape a unified external image, deeply communicate the company's core spirit and values, and lay a solid foundation for the company’s future development.

6. AI deployment occurs in three stages. Currently, AI is in the early stage of infrastructure development. The next stage will be the Physical AI era, where AI capabilities will be incorporated into self-driving cars, robots, drones, and more. The third stage—Scientific AI—will see AI used to solve scientific problems.

China Semiconductor Industry Updates

1. The State-owned Assets Supervision and Administration Commission (SASAC) of the State Council has stated that the next step will involve the strategic restructuring of central automotive state-owned enterprises to increase industry concentration while focusing on addressing issues such as disorderly competition in the automotive sector.

2. The "Implementation Opinions on Promoting the Innovation and Development of the Intelligent Computing Cloud Industry in Shanghai (2025-2027)" aim to surpass a scale of 200 billion yuan in the city's intelligent computing cloud industry by 2027, creating a collaborative ecosystem that integrates cloud, edge, and terminal technologies along with a complete industrial chain.

3. In 2024, the integrated circuit manufacturing industry in Guangzhou achieved a total output value of 26.275 billion yuan, marking a year-on-year growth of 7.19%.

4. NIO’s self-developed chip, the "Shenji NX9031," is the industry’s first high-end intelligent driving chip manufactured using 5nm automotive-grade technology. It integrates over 50 billion transistors, delivering exceptional performance.

5. TSMC plans to focus its investments in Taiwan on the most advanced processes and packaging technologies. Future investments in Taiwan are expected to exceed $300 billion.

6. Hefei plans to establish a 10 billion yuan future industry fund, with 2 billion yuan earmarked for the construction of public service platforms over the next three years, along with an annual special subsidy of 100 million yuan, to comprehensively support the development of the intelligent robotics industry.