Global Semiconductor Industry Updates

1. Apple has launched the M3 Ultra chip.

2. Google plans to expand its chip development operations in Israel and is recruiting dozens of employees to develop a new type of communication chip—network interface cards.

3. Toshiba Electronics’ IGBT packaging and testing factory has officially completed construction and will begin full production in June this year.

4. The South Korean government will establish a $34 billion policy fund to provide financial support to companies involved in strategic technologies like chips and automobiles.

5. Malaysia is set to invest $250 million in acquiring ARM chip technology licenses.

6. ASML plans to open a new reuse and repair center in Beijing in 2025.

China Semiconductor Industry Updates

1. Hangzhou Gallium Semiconductor has launched its fourth-generation gallium oxide 8-inch wafer, becoming the first company globally to master the technology for growing 8-inch gallium oxide single crystals.

2. According to "Yanbian News," the first chip packaging and testing project in the region—the Quanchip Micro Integrated Circuit Packaging and Testing Project—is expected to complete part of its production line debugging in April and begin trial production.

3. Slkor (www.slkoric.com) is a national high-tech enterprise specializing in domestic alternatives. Its product range is diverse, covering MOSFETs, IGBTs, Hall sensors, silicon carbide devices, linear regulators (LDOs), and more, providing alternatives to international brands like Infineon, Texas Instruments, and ON Semiconductor.

4. TSMC's former CEO, Morris Chang, has joined Micron Technology as a board member.

5. Xinyuan Micro is planning a change in control, and the company’s stock has been suspended from trading since March 6.

6. TSMC Chairman Mark Liu stated that the company plans to build 11 production lines in Taiwan this year.