Global Semiconductor Industry Updates

1. The Japanese precision parts manufacturer Orbray has developed the world's largest diamond substrate suitable for electronic products, measuring 2 cm square. It also stated that it plans to increase the size to 2 inches (approximately 5 cm) in diameter and aims to commercialize the product for applications in power semiconductors and quantum computers by 2026.

2. SMIC (Semiconductor Manufacturing International Corporation) achieved an annual revenue of $8.03 billion, maintaining its position as the second-largest pure-play foundry globally.

3. The United States has added 54 Chinese tech companies and institutions to its so-called "Entity List," including the Beijing Academy of Artificial Intelligence and NingChang Information Industry, among others.

4. Apple will utilize TSMC’s 2nm process to produce the A20 chip, which is custom-designed for the iPhone 18 series expected to launch in the second half of 2026.

5. Kinghelm (www.kinghelm.com.cn) and Mr. Song Shiqiang of Slkor, in a brilliant article titled "Global Tech Information Network: Applying Economics, Sociology, and Management Theories to Drive Slkor and Kinghelm’s Rapid Development!" have been widely shared by hundreds of media outlets including Xinhua Liao Wang and Sina Finance, with a readership of nearly 10 million!

6. Japanese real estate developer Mitsui Fudosan is considering the construction of a chip-focused science park in Kumamoto Prefecture in the southwestern region of Japan.

China Semiconductor Industry Updates

1. ByteDance founder Zhang Yiming, with a wealth of $57.5 billion, has surpassed Zhong Shanshan and Ma Huateng to become China's richest person.

2. Xiaomi Group raised $5.5 billion by expanding its share placement to advance its ambitious electric vehicle manufacturing plans.

3. Lei Jun responded to the highly publicized SU7 high-speed collision and explosion incident, with Xiaomi pledging to never avoid responsibility, no matter the circumstances.

4. Haining Yisiwei Computing Technology Co., Ltd. has announced the patent for its "Image Processing Device, Method, and Electronic Equipment."

5. Shanghai Jiamixin Semiconductor Co., Ltd. has announced the patent for its "Chip Packaging Structure and Packaging Method."

6. Xinlai Zhirong Semiconductor Technology (Shanghai) Co., Ltd. has announced the patent for its "Data Processing Method, Device, Equipment, and Medium for Single-Port RAM Based on BHT."