Product Details

Features

lHigh Current Capability

lLow Forward Voltage Drop

lExtremelyFast Switching Speed

Mechanical Data

lSmall Outline Plastic Package

lEpoxy UL: 94V-0

lMounting Position:Any

BAS70W-05 SOT-323_00.jpg

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2024-12-25United Microelectronics Corporation (UMC) has successfully secured a large-scale advanced packaging order from Qualcomm for its HPC chips based on the Oryon CPU architecture.
2024-12-24A recent report from French market research firm KnowMade reveals that Chinese companies account for approximately 70% of global SiC patent applications.
2024-12-23The "Measures for Shenzhen to Become a Pioneer City in Artificial Intelligence" have been released, aimed at establishing Shenzhen as a global leader in AI development.
2024-12-20TSMC's Kumamoto factory will begin mass production within this year, utilizing 22/28nm and 12/16nm process technologies to manufacture logic ICs.
2024-12-19Deepen Cooperation and Create the Future Together | The 2024 SLKOR Annual Agent Seminar was successfully concluded
2024-12-19Silicon Zhen has announced the successful mass production of QRNG-10, the first-ever millimeter-level quantum random number generator chip developed in-house in China
2024-12-18How does SLKOR achieve rapid growth without overtime work? (I)
2024-12-18TSMC Chairman and CEO C.C. Wei stated that many customers have mentioned AI and applications in their future expectations and plans. However, more customers are optimistic about multifunctional robots rather than automobiles
2024-12-17TSMC has publicly unveiled its 2nm process, which increases transistor density by 15% compared to the 3nm chips, boosts performance by 15% at the same power consumption, and reduces power consumption by 24-35% for the same performance.
2024-12-16CATL and Stellantis are planning to build a joint venture battery factory in Zaragoza, Aragon, Spain, with Stellantis as the primary customer. The total construction period is expected to last four years

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