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The Underlying Logic of the Development of Kinghelm and SLKOR (Part 2)

Updated: 2024-12-26
Views: 5852

Shenzhen Huaqiangbei who are engaged in the electronic component trading business are at a loss. However, even in this harsh market and dispirited atmosphere, there is a breath of fresh air. This year, Kinghelm and SLKOR have continued to maintain a high growth rate of 100% for two consecutive years. In July and Septem……

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The CEO of the Semiconductor Industry Association of America expressed concerns over China's recent restrictions on purchasing U.S. chips and urged the U.S. Trade Representative’s office to handle the matter with caution.

Updated: 2024-12-26
Views: 9107

Samsung Electronics plans to comprehensively restructure its advanced semiconductor packaging supply chain, which is expected to have a significant impact on both domestic and international semiconductor industries.

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United Microelectronics Corporation (UMC) has successfully secured a large-scale advanced packaging order from Qualcomm for its HPC chips based on the Oryon CPU architecture.

Updated: 2024-12-25
Views: 10078

The U.S. government has announced a new policy designating major cloud service providers like Google and Microsoft as "gatekeepers" for global AI chip distribution.

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A recent report from French market research firm KnowMade reveals that Chinese companies account for approximately 70% of global SiC patent applications.

Updated: 2024-12-24
Views: 12507

Micron Technology has announced the development of its "advanced" HBM4 and HBM4E processes, with mass production expected in 2026.

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The "Measures for Shenzhen to Become a Pioneer City in Artificial Intelligence" have been released, aimed at establishing Shenzhen as a global leader in AI development.

Updated: 2024-12-23
Views: 11379

Micron has announced the latest developments in its next-generation HBM4 and HBM4E processes, which are expected to enter mass production in 2026.

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TSMC's Kumamoto factory will begin mass production within this year, utilizing 22/28nm and 12/16nm process technologies to manufacture logic ICs.

Updated: 2024-12-20
Views: 10350

Infineon, the German semiconductor manufacturer, is actively advancing its localization strategy for commercial-grade products and maintaining close business ties with the Chinese market.

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Deepen Cooperation and Create the Future Together | The 2024 SLKOR Annual Agent Seminar was successfully concluded

Updated: 2024-12-19
Views: 5688

On the occasion of the coming of the winter solstice, the New Product Training Conference for SLKOR's 2024 Annual Agents was successfully held in the meeting r……

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Silicon Zhen has announced the successful mass production of QRNG-10, the first-ever millimeter-level quantum random number generator chip developed in-house in China

Updated: 2024-12-19
Views: 10115

Infineon has established an office in Kaohsiung to deepen its collaboration with Taiwan in the field of semiconductor testing and packaging.

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How does SLKOR achieve rapid growth without overtime work? (I)

Updated: 2024-12-18
Views: 5554

In recent years, all industries have been highly competitive. Working overtime but experiencing negative performance growth has become the norm. Major Internet companies like Alibaba have carried out large-scale layoffs. ByteDance has cut to the core. Liu Qiangdong of JD.com has let go of the laid-back employees. The b……

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TSMC Chairman and CEO C.C. Wei stated that many customers have mentioned AI and applications in their future expectations and plans. However, more customers are optimistic about multifunctional robots rather than automobiles

Updated: 2024-12-18
Views: 10517

The U.S. Department of Commerce's Bureau of Industry and Security (BIS) has updated its export control list, adding a total of eight entities to the Entity List: two from China, four from Russia, and two from Myanmar.

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TSMC has publicly unveiled its 2nm process, which increases transistor density by 15% compared to the 3nm chips, boosts performance by 15% at the same power consumption, and reduces power consumption by 24-35% for the same performance.

Updated: 2024-12-17
Views: 11731

The financing for the ESMC Dresden wafer plant, co-funded by the German government, TSMC, Bosch, Infineon, and NXP, has been launched, with a total investment of over 76 billion yuan.

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CATL and Stellantis are planning to build a joint venture battery factory in Zaragoza, Aragon, Spain, with Stellantis as the primary customer. The total construction period is expected to last four years

Updated: 2024-12-16
Views: 10308

ON Semiconductor has reached an agreement to acquire Qorvo's Silicon Carbide Junction Field-Effect Transistor (SiC JFET) technology business and its subsidiary United Silicon Carbide for $115 million in cash.

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