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Industry Highlights

Slkor's Daily Semiconductor News focuses on in-depth coverage and cutting-edge technology analysis in the semiconductor industry. It comprehensively interprets the latest trends and industry dynamics, providing authoritative insights and market perspectives to readers. Covering all areas from chip design, manufacturing to applications, it helps industry professionals stay informed about market conditions and drive innovation.

United Microelectronics Corporation (UMC) has successfully secured a large-scale advanced packaging order from Qualcomm for its HPC chips based on the Oryon CPU architecture.

Updated: 2024-12-25
Views: 9722

The U.S. government has announced a new policy designating major cloud service providers like Google and Microsoft as "gatekeepers" for global AI chip distribution.

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A recent report from French market research firm KnowMade reveals that Chinese companies account for approximately 70% of global SiC patent applications.

Updated: 2024-12-24
Views: 10966

Micron Technology has announced the development of its "advanced" HBM4 and HBM4E processes, with mass production expected in 2026.

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The "Measures for Shenzhen to Become a Pioneer City in Artificial Intelligence" have been released, aimed at establishing Shenzhen as a global leader in AI development.

Updated: 2024-12-23
Views: 10147

Micron has announced the latest developments in its next-generation HBM4 and HBM4E processes, which are expected to enter mass production in 2026.

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TSMC's Kumamoto factory will begin mass production within this year, utilizing 22/28nm and 12/16nm process technologies to manufacture logic ICs.

Updated: 2024-12-20
Views: 9462

Infineon, the German semiconductor manufacturer, is actively advancing its localization strategy for commercial-grade products and maintaining close business ties with the Chinese market.

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Silicon Zhen has announced the successful mass production of QRNG-10, the first-ever millimeter-level quantum random number generator chip developed in-house in China

Updated: 2024-12-19
Views: 9700

Infineon has established an office in Kaohsiung to deepen its collaboration with Taiwan in the field of semiconductor testing and packaging.

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TSMC Chairman and CEO C.C. Wei stated that many customers have mentioned AI and applications in their future expectations and plans. However, more customers are optimistic about multifunctional robots rather than automobiles

Updated: 2024-12-18
Views: 9928

The U.S. Department of Commerce's Bureau of Industry and Security (BIS) has updated its export control list, adding a total of eight entities to the Entity List: two from China, four from Russia, and two from Myanmar.

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TSMC has publicly unveiled its 2nm process, which increases transistor density by 15% compared to the 3nm chips, boosts performance by 15% at the same power consumption, and reduces power consumption by 24-35% for the same performance.

Updated: 2024-12-17
Views: 10267

The financing for the ESMC Dresden wafer plant, co-funded by the German government, TSMC, Bosch, Infineon, and NXP, has been launched, with a total investment of over 76 billion yuan.

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CATL and Stellantis are planning to build a joint venture battery factory in Zaragoza, Aragon, Spain, with Stellantis as the primary customer. The total construction period is expected to last four years

Updated: 2024-12-16
Views: 9776

ON Semiconductor has reached an agreement to acquire Qorvo's Silicon Carbide Junction Field-Effect Transistor (SiC JFET) technology business and its subsidiary United Silicon Carbide for $115 million in cash.

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According to the latest data from the China Charging Alliance, the number of charging stations nationwide has exceeded 12 million, marking a 49.5% year-on-year increase

Updated: 2024-12-13
Views: 9552

Nvidia is ramping up its recruitment efforts in China to focus on the development of AI-powered vehicles, with plans to hire an additional 4,000 employees.

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TSMC is expected to certify an ultra-large version of its CoWoS (Chip-on-Wafer) packaging technology by 2027. This technology will offer intermediate layer sizes of up to nine mask sizes and support 12 HBM4 memory stacks. It is speculated that it will be adopted by ultra-high-end AI processors between 2027 and 2028.

Updated: 2024-12-12
Views: 10675

In the first 11 months of this year, China’s integrated circuit exports totaled 1.03 trillion yuan, surpassing the 1 trillion yuan mark for the first time, with a year-on-year growth of 20.3%

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TSMC's 2nm process trial production results show a yield rate exceeding 60%, with plans to begin mass production of 2nm chips next year

Updated: 2024-12-11
Views: 9757

TaiLynx Microelectronics' TLSR9 series SoC Zigbee protocol stack has been certified with ZigbeePRO R23 + Zigbee Direct, making it the first domestic chip company to achieve this certification.

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