1.3 Overview of NIST and Chip Metrology Program

Dr. Marla Dowell, from the Chip Metrology Program and NIST Boulder Laboratory, delivered a popular keynote speech at the working group meeting. The keynote speech began by reminding attendees of NIST's mission: to promote U.S. economic security, improve our quality of life, and achieve innovation and industrial competitiveness by advancing measurement science, standards, and technology.

It highlighted NIST's core capabilities of (1) measurement science, (2) rigorous traceability, and (3) development and use of standards. Dowell provided details on the Chip Metrology Program, organizational relationships, and the background of national research institutions at NIST. Dowell emphasized the need for industry and NIST collaboration to collectively address the microelectronics challenges faced by the chip industry. She emphasized that NIST is a non-regulatory laboratory and has been a trusted proprietary information partner, neutral and objective, supporting the development of key technologies that promote U.S. innovation and industrial competitiveness by disseminating high-quality measurements, data, and research. Specifically, in Boulder, NIST has around 900 staff members and over 500,000 square feet of laboratory space, including six areas: (1) Advanced Communications Technology, (2) Quantum Science and Engineering, (3) Time and Frequency Metrology, (4) Advanced Materials Characterization, (5) Precision Imaging, and (6) Laser and Optoelectronics. Dowell then highlighted the long-standing investment portfolio of NIST in the microelectronics field, involving many areas.

Dowell later discussed the "American CHIPS Act" and outlined the strategic aspects of the U.S. funding for chips, including how it will support three distinct initiatives: (1) significant investments in leading-edge manufacturing, (2) new manufacturing capabilities for mature chips, advanced chips, new technologies, and specialized expertise, and (3) strengthening U.S. leadership in research and development. The distinction between the $39 billion for manufacturing incentives and $11 billion for R&D incentives was highlighted, with a focus on research funding and NIST's measurement science appropriations. Dowell discussed how the semiconductor manufacturing industry, academia, and government provided extensive feedback through seven identified strategic opportunities, including the EUVL working group meeting.

The Communications Technology Laboratory (CTL) provided an example of material metrology, and prior to becoming the Director of the Chip Metrology Program, Dr. Dowell served as the Division Chief there, particularly in the area of 5G material standard reference materials (SRMs). The NIST SP1278 document she co-authored was presented as an example of how metrology improves the security and traceability of microelectronic components and products.

Concluding the keynote speech, Dowell introduced NIST publications that provide metrology opportunities related to chips. Additionally, on the morning of April 25th, 2023, her department released a document outlining the vision and strategies of the National Semiconductor Technology Center, describing how future industry and NIST interaction will take place.

Dr. Stephanie Hooker, Acting Director of the Materials Metrology Laboratory (MML) at the National Institute of Standards and Technology (NIST), delivered a keynote speech at the working group meeting, welcoming the attendees before the afternoon sessions. Hooker reiterated NIST's mission and emphasized its greatest strength as its reputation among world-class engineers and scientists. Besides sharing NIST's scale and capabilities, the focus was on the measurement services provided by NIST. The measurement services include over 1100 Standard Reference Materials (SRMs), approximately 100 Standard Reference Data (SRD) products, 5 Quality Assurance Programs, and a wealth of data tools and registries. Emphasis was also placed on documentary standards and how over 400 NIST technical staff participate in over 100 standards committees, holding leadership positions in many international standards organizations, thereby enhancing U.S. competitiveness globally. Her speech highlighted key technology areas in which NIST is involved and expanding, including artificial intelligence (AI), quantum science, advanced communications, advanced manufacturing, and the bioeconomy. Hooker concluded by introducing established engagement areas and methods of collaboration with NIST, including working group meetings, consortia, CRADAs, and MTAs, which are also the focus of this report.

These two keynote speeches demonstrated the cohesion and participation between the working group members and NIST leadership.

EUVL (Extreme Ultraviolet Lithography) technology

A detailed introduction has been provided on the technical aspects of EUVL proposed and discussed at the working group meeting. The following are three specific sections (2.1-2.3) dedicated to the discussion of the EUV source module. Then, the current status and requirements of components interacting with EUV light are discussed (2.4). Both of these components interact with EUV light. Finally, the use of EUV light as a metrology tool for analyzing components in semiconductor manufacturing processes is introduced (2.5). The metrology aspect of EUV light as a tool is directly related to the radiation measurements discussed in Section Sec. The technical details discussed here have already been publicly released. However, combining the technical expertise and status of industrial and NIST research in one report is useful for understanding the technological landscape. Review references have been included to complement the technical details provided in this report.

To be continued...