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【Daily Highlight】Behind the AI Chip Breakthrough: How Semiconductor Protection Components Support the Computing Power Revolution?

release time:2025-03-26Author source:SlkorBrowse:1993

Introduction: As AI Chips Break Through Moore's Law, Protection Technology Becomes the Invisible Battleground

 

Recently, the news of Zhuhai Haoze Technology's self-developed ultra-efficient storage-computing integrated AI chip VVT300 successfully entering the tape-out phase has sparked heated discussions in the semiconductor industry. This chip, with its groundbreaking energy efficiency and computing power integration, marks a symbolic moment in the rise of domestic AI chips. However, beneath the soaring computing power, one often-overlooked truth is that every leap in chip performance relies on the silent protection of protective components. The SLESD5Z36 transient suppression diode launched by Slkor Semiconductor is quietly building a robust shield for hardware security in the AI era, positioning itself as an "invisible champion."

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Slkor Transient Protection Diode SLESD5Z36 product photo

1. The Explosion of AI Chips: Protection Needs Growing Exponentially

The high-density integration and low-power design of AI chips make them increasingly sensitive to transient voltage events such as electromagnetic interference (EMI) and electrostatic discharge (ESD). The success of the tape-out for Zhuhai Haoze's VVT300 represents a breakthrough in advanced process technology and architectural design by domestic manufacturers, but the hidden challenges behind it are also worth attention:

 

- Nanometer-level Process Vulnerability: In 7nm/5nm processes, the gate oxide layer thickness is only 1-2nm, and a single ESD event can cause irreversible damage.

- Signal Integrity at High Frequencies: AI chips process analog and digital signals in parallel, requiring protective components to have both low capacitance (<30pF) and high response speed.

- Power Consumption and Heat Dissipation Balance: Protection devices must avoid becoming bottlenecks in thermal design while meeting AEC-Q101 and other automotive-grade certification requirements.

 

The introduction of Slkor's SLESD5Z36 precisely addresses these pain points. Its 28pF ultra-low capacitance, 55V clamping voltage, and SOD-523 micro-package combination make it almost invisible in terms of additional parasitic parameters when protecting AI chip I/O ports, power rails, and high-speed interfaces, becoming the "invisible guardian" for high-integration designs.

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Slkor Transient Protection Diode SLESD5Z36 specification

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Parameters of Slkor Transient Protection Diode SLESD5Z36

2. Technical Breakdown: How the SLESD5Z36 Sets a New Benchmark for AI Protection

Parameter SLESD5Z36 Traditional TVS Diode
Package Size 0.8mm × 0.6mm ≥1.0mm × 0.6mm
Capacitance 28pF (@1MHz) 50-100pF
Leakage Current 5μA (@36V) ≥10μA
Clamping Response <1ns >5ns

 

Three Core Advantages Empower AI Scenarios:

1. Ultra-Low Capacitance Design: Protects high-speed interfaces such as AI chip PCIe 5.0/HDMI 2.1 without signal distortion, supporting 28Gbps data transmission.

2. Precise Clamping Capability: The "golden gap" between 55V clamping voltage and 40V breakdown voltage ensures rapid conduction during ESD strikes while preventing false triggers.

3. Thermal Stability: Using optimized doping processes, it maintains over 90% protection effectiveness even at 125°C, adapting to harsh scenarios such as autonomous driving domain controllers.

 

3. Ecological Collaboration: From "Point Protection" to "System-Level Security"

Slkor's technological breakthroughs are reshaping the semiconductor protection logic. AI chips like Zhuhai Haoze's VVT300 require more than just stacking traditional TVS diodes for protection; they demand:

 

- Full Lifecycle Protection: From wafer-level testing to end-user applications, Slkor provides protection solutions with HBM 8kV, CDM 1.5kA levels.

- Customized Design Support: Optimizing the AI chip power delivery network (PDN), Slkor offers multi-channel array-based protection layouts.

- Failure Mode Warning: By integrating temperature sensors and intelligent monitoring ICs, real-time monitoring of the protection component's health status is achieved.

 

Conclusion: The “Invisible Guardians” of the AI Revolution Are Awakening

While the industry focuses on the computing power arms race, Slkor proves with the SLESD5Z36 that every step forward in semiconductor security is laying a solid foundation for technological innovation. From Zhuhai Haoze's VVT300 to the global AI chip wave, protective components are becoming the "invisible gene" that determines a product's success or failure. For engineers, choosing Slkor means adopting a "prevention-first" hardware philosophy—because in the age of computing power acceleration, security is never a luxury but a necessity for survival.

 

About Slkor:

Slkor has research and development offices in Busan, South Korea, Beijing, China, and Suzhou, China. Most of the wafer manufacturing and packaging and testing are carried out within China. The company employs and collaborates with individuals and organizations worldwide, with a laboratory for product performance and reliability testing and a central warehouse located at its headquarters in Shenzhen. Slkor has filed for over a hundred invention patents, offers more than 2,000 product models, and serves over ten thousand customers globally. Its products are exported to countries and regions including Europe, the Americas, Southeast Asia, and the Middle East, making it one of the rapidly growing semiconductor companies in recent years. With well-established management systems and streamlined workflows, Slkor has rapidly enhanced the brand awareness and reputation of its "SLKOR" brand through its outstanding quality and standardized services. Its product range includes three major series: diodes, transistors, and power devices, with recent introductions of new products such as Hall elements and analog devices, expanding its presence in sensors, Risc-v microcontrollers, and other product categories.


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