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RS-232 Transceiver RS-485 Transceiver CAN Transceiver

SL3232E RS232 Transceiver SOP-16

SL232E RS232 Transceiver SOP-16

SL3232EESE RS232 Transceiver SOP-16

SL8022KS Touch Screen Controllers SOP-8

74LVC1G07DBVR IC BUFF/DRVR W/OD OUT SOT-23-5

LM1881 Video Sync Separator SOP-8

-	-	-	-	-	-
3V 4.5V 5.5V 5V	1mA 10mA 2mA 60uA 4uA 5.2mA	6V/μs 30V/mks 30V/μs -	120kbit/c 140kbit/c -	SOP-16 SOP-8 SOT-23-5

3V	1mA	6V/μs	120kbit/c	SOP-16
4.5V	10mA	30V/mks	140kbit/c	SOP-16
5.5V	2mA	30V/μs	-	SOP-16
3V	60uA	-	-	SOP-8
5.5V	4uA	-	-	SOT-23-5
5V	5.2mA	-	-	SOP-8

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2024-12-17TSMC has publicly unveiled its 2nm process, which increases transistor density by 15% compared to the 3nm chips, boosts performance by 15% at the same power consumption, and reduces power consumption by 24-35% for the same performance.
2024-12-16CATL and Stellantis are planning to build a joint venture battery factory in Zaragoza, Aragon, Spain, with Stellantis as the primary customer. The total construction period is expected to last four years
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2024-12-12TSMC is expected to certify an ultra-large version of its CoWoS (Chip-on-Wafer) packaging technology by 2027. This technology will offer intermediate layer sizes of up to nine mask sizes and support 12 HBM4 memory stacks. It is speculated that it will be adopted by ultra-high-end AI processors between 2027 and 2028.
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