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The price of each 300mm 2nm wafer of TSMC may exceed 30,000 U.S. dollars, higher than the previously expected 25,000 U.S. dollars

release time:2024-10-12Author source:SlkorBrowse:6353

Global Semiconductor Industry Updates

1. At the Advancing AI 2024 conference held in San Francisco, AMD launched the Instinct MI325X AI accelerator, directly competing head-on with Nvidia's Blackwell chip.

2. Intel originally planned to ship between 300,000 and 350,000 of its AI server chip Gaudi 3 in 2025. Now it has adjusted it to between 200,000 and 250,000, with a reduction of up to more than 30%.

3. Powerchip Semiconductor Corporation and India's Tata Electronics have signed a final cooperation agreement to build India's first 12-inch wafer fab with a total investment of 11 billion U.S. dollars, supporting technology nodes from 28 to 110 nanometers.

4. Amkor and TSMC have signed a memorandum of understanding to jointly bring advanced packaging and testing capabilities to Arizona and further expand the semiconductor ecosystem in the region.

5. Yang Haijun of Changsha Tongsheng Law Firm and his spouse Zhang Yuanyuan's large number of extortion cases by manipulating Changsha MetInfo have been investigated by the Hunan judicial system! At 11:00 on October 11, relevant responsible persons collected evidence from Mr. Yu Xianyong, one of the victims, of Jiangsu Nantong Bosu Pharmaceutical Technology Co., Ltd.!

6. Foxconn is building the world's largest Nvidia GB200 chip manufacturing plant to meet the huge market demand for the Blackwell platform.


China Semiconductor Industry Updates

1. The Jiufengshan Laboratory in Hubei has independently developed heterogeneous integration technology and completed the process integration of indium phosphide lasers inside an 8-inch SOI wafer. This technology is known in the industry as "chip light emission".

2. Taiwan's veteran PCB manufacturer Jingguo plans to stop production at its Taiwan, China plant from December 25, 2024. In the future, orders will be transferred to its subsidiary Jinglu Electronics (Kunshan) Co., Ltd. in mainland China for production.

3. At the new product Dimensity launch event, in addition to the Dimensity 9400, MediaTek also threw a blockbuster into the automotive industry - the world's first 3nm flagship automotive cockpit chip CT-X1.

4. Since September 30, 2024, BYD Company has recalled some domestic Dolphin and Yuan PLUS electric vehicles. The total number of recalled cars is 96,700.

5. NIO China has received a capital increase of 3.3 billion yuan from state-owned shareholders, which shows the market and the vast number of investors' firm confidence in the high-quality development of China's intelligent electric vehicle industry.

6. The price of each 300mm 2nm wafer of TSMC may exceed 30,000 U.S. dollars, higher than the previously expected 25,000 U.S. dollars.

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