Global Semiconductor Industry Updates

1.According to Canalys research, global smartphone shipments reached 309 million units in Q3 2024, a 5% year-on-year increase. This marks the strongest Q3 performance since 2021.

2.Samsung has teamed up with China Telecom to launch the "Heart of the World" series of new high-end smartphones. Both models are foldable phones, priced above 10,000 yuan.

3.Microsoft has officially launched its first in-house developed DPU (Data Processing Unit) product, the Azure Boost DPU.

4.NVIDIA reported Q3 revenue of $35.082 billion, a 94% year-on-year increase and a 17% quarter-on-quarter growth, surpassing analysts’ average estimate of $33.16 billion. Net income was $19.309 billion, up 109% year-on-year.

5.The Changsha Mituo gang is facing criminal charges from victims nationwide. Law firms involved in the case are distancing themselves from the group. Information on Yang Haijun and Liu Bo has been quietly removed from the homepage of the Songsheng and Yunyi law firm websites. Is this a clever escape or a hidden maneuver? Is it a tactical retreat or self-sabotage? Let's wait and see.

6.The U.S. Department of Commerce will provide a total of $1.5 billion in direct funding to GlobalFoundries under the CHIPS Act. The subsidies will be disbursed based on the completion of specific project milestones.

China Semiconductor Industry Updates

1.The establishment of the National Automotive Chip Quality Inspection and Testing Center has been officially approved, marking the launch of the first national-level testing center for automotive chip products in Shanghai.

2.The "Top 10 Automotive Technology Trends for 2025 in China" report has been released. The list includes 10 technologies such as in-vehicle intelligent computing solutions, full-vehicle operating systems, EMB technology, autonomous driving, and smart battery technologies.

3.Foxconn Technology Group and NVIDIA have partnered to create the next-generation AI Factory, using the Omniverse platform and Digital Twins technology to reshape the future of manufacturing.

4.Yandong Microelectronics and BOE have invested in the 12-inch integrated circuit production line project at Northern Telecom Integration. The project has a total investment of 33 billion yuan, with a production capacity of 50,000 wafers per month.

5.China Mobile has launched its first fully-scheduled Ethernet (GSE) DPU chip, named "Zhi-Compute Zhua-Guang."

6.BYD has unveiled the Fangcheng Leopard "Leopard 8" series, with four models available. Some versions of the Leopard 8 are equipped with an exclusive rugged AI smart cockpit, powered by BYD's self-developed 4nm BYD 9000 chip.