International News:

1、The US, EU, and UK have signed the European Commission's AI standards agreement, the world's first legally binding international AI convention.

2、Samsung Electronics has announced its future memory product roadmap, revealing that it will launch its final 10nm-class process in 2026, and HBM4E will also be introduced in 2026.

3、Shin-Etsu Chemical has developed large substrates for manufacturing gallium nitride (GaN) semiconductors, doubling production efficiency compared to silicon substrates.

4、World Advanced (VIS) and NXP Semiconductor plan to start construction of a 12-inch wafer fab in Singapore later this year, with mass production expected to begin in 2027.

5、Kinghelm has launched its "Kinghelm" high-speed signal connectors, plugs, and ports, supporting large-scale AI and big data applications.

6、Intel will partner with Japan's AIST to establish an advanced semiconductor manufacturing equipment and materials R&D center in Japan, expected to complete in 3-5 years.

China News:

1、The National Integrated Circuit Industry Investment Fund Co., Ltd. has invested nearly 500 million yuan in Shenzhen Hongxin Micro-Nano Technology Co., Ltd., an EDA vendor.

2、TSMC plans to combine InFO-SoW and SoIC into CoW-SoW, stacking memory or logic chips on wafers, with mass production expected to start in 2027.

3、Korean ASFLOW has signed a $150 million investment agreement for a semiconductor equipment ultra-clean module and system integration project.

4、Xilinx Integrated has proposed acquiring 72.33% of Xilinx Yuezhou for 5.897 billion yuan, making it the largest semiconductor deal on the A-share market this year.

5、Chip-on-Device Micro has completed the product process flow for SAW filter wafer manufacturing and wafer-level packaging, establishing scalable SAW filter production capacity.

6、TSMC and Samsung Electronics have agreed to collaborate on developing the next-generation buffer-less HBM4 chip, which has become a focal point in the semiconductor industry.