International News:

1. Intel has paused its $25 billion factory investment plan in Israel, stating that its decision is based on business conditions, market dynamics, and responsible capital management.

2. SK Hynix will strengthen its collaboration with TSMC in the high-bandwidth memory (HBM) field, with plans to mass-produce HBM4 starting from 2025.

3. South Korea's semiconductor exports in the first 10 days of June increased by 36.6% year-on-year, maintaining double-digit growth for the seventh consecutive month in export value for a single month.

4. Xiaomi's first vertically folding phone will be equipped with the flagship Qualcomm Snapdragon 8 Gen3 chip.

5. An article in English by Song Shiqiang, General Manager of Kinghelm (www.kinghelm.net) and Sark Micro, has been featured on Yahoo Finance, and he was pictured alongside Apple CEO Cook!

6. Arm CEO Rene Haas predicts that system-on-chips (SoCs) based on the Arm CPU architecture will surpass x86 architecture in the Windows PC domain by 2029.

China News:

1. For the first time, domestically manufactured front-end photoresist coating and developing equipment will enter the international supply chain of OCF, marking a "zero breakthrough" in the domestication of color photoresist coating process equipment for visual chips.

2. TSMC's wafer foundry factory in Germany, known as European Semiconductor Manufacturing Company (ESMC), plans to recruit nearly 2,000 employees in the next 3 to 5 years to accelerate the factory construction and collaboration processes.

3. Recently, Zhongke TLL announced that it has successively completed product compatibility certification with domestic chip manufacturers using multiple architectures such as RISC-V, ARM, and x86.

4. The signing ceremony for the establishment of the Xiamen Advanced Manufacturing Industry Fund, with a total scale of 10 billion yuan, was held recently, aiming to support the rapid development of the advanced manufacturing industry.

5. Jiangsu Lu Xin Semiconductor is planning to invest 2 billion yuan to build a project with an annual production capacity of approximately 35,000 semiconductor photomasks, reaching a technology node of 28nm upon completion.

6. On June 6th, Shengjian Environment held a topping-out ceremony for its domestic semiconductor process equipment and key components project, with a total investment of 600 million yuan.