International News:

1. Intel's next-generation AI chip Falcon Shores will utilize TSMC's 3nm process and CoWoS advanced packaging technology, slated for mass production by the end of next year.

2. Samsung's 10.7Gbps LPDDR5X has been validated on MediaTek's next-generation Dimensity mobile platform.

3. The EU has officially released the final complete version of the "Artificial Intelligence Act," with partial enforcement starting on August 1st.

4. Samsung faces difficulties in securing major foundry clients, leading to a halt in construction of the Pyeongtaek P4 plant.

5. Alphabet, Google's parent company, plans to acquire cybersecurity startup Wiz for approximately $23 billion.

6. Counterpoint's latest research report indicates that 5G and 5G RedCap will become mainstream in the automotive industry by 2030, presenting significant opportunities for chips and modules.

China News:

1. China's largest automobile dealer, Guanghui Automobile, is reported to have withheld employee wages, with several 4S stores closing down, plunging the company into a crisis.

2. Ericsson and OPPO have signed a necessary patent cross-licensing agreement covering cellular technologies including 5G, with OPPO agreeing to pay patent licensing fees to Ericsson.

3. The first "SLKOR" Cup Factory BA Basketball League concluded, with Song Shiqiang representing the SLKOR brand presenting bonuses, medals, and trophies to the championship team from Deyi Hui Zhi Zao.

4. Luo Daojun, Vice Minister of the Ministry of Industry and Information Technology, publicly stated that China's self-sufficiency rate in chips is only 10%.

5. Huawei has announced that the mobile film "Hua Jing," shot with the Huawei Pura70 series, is set to premiere soon.

6. TSMC plans to implement a pricing adjustment strategy next year, with wafer fabrication services potentially seeing up to a 10% price increase, leading to more expensive chips.