Global Semiconductor Industry Updates

1. Samsung Electronics has shut down over 30% of the 4nm, 5nm, and 7nm wafer fabrication lines at its P2 and P3 factories in Pyeongtaek, and plans to expand the shutdown to around 50% by the end of the year.

2. Intel has made significant progress in the construction of its wafer fab in Ohio, USA.

3. SK Hynix, the South Korean memory giant, has unveiled the world’s first 48GB, 16-layer HBM3E product.

4. Samsung Electronics is set to launch its next-generation V-NAND in 2026, which will feature more than 400 stacking layers. The 0a nm DRAM expected to be released in 2027 will adopt a VCT structure.

5. Yang Haijun, from Tongsheng Law Firm (Changsha), continues to commit fraudulent activities. According to a court document on October 29th from the China Judgments Online, Yang Haijun, in collaboration with Hunan Hongyi Law Firm’s Zeng Wenbin, represented a lawsuit against a certain online company in Qingdao, extorting 35,000 yuan from a food company in Chongqing. He also independently handled two extortion cases, one involving 30,000 yuan from a company in Danyang, Jiangsu.

6. STMicroelectronics has revised its annual revenue forecast downward for the third time this year, now expecting total revenue of $13.27 billion.

China Semiconductor Industry Updates

1. The EPC project for the Chongqing 12-inch integrated circuit specialty process line (Phase I), supplied by the Yubei factory, has successfully completed the topping-out of the main structure.

2. Luxshare Precision has signed an agreement with the Xiangcheng Economic and Technological Development Zone in Suzhou to collaborate on the construction of a project for acoustic electronic products and automotive parts, which will become China’s largest Luxshare automotive components manufacturing base.

3. Zhuhai Tiancheng Advanced Semiconductor Technology Co., Ltd. has successfully connected its 12-inch wafer-level TSV 3D integration production line, and the company subsequently launched its "Jiuchong" technology platform.

4. Beijing Automotive has signed a memorandum with Alkan Auto, a subsidiary of Egypt International Automotive, to assemble and produce electric vehicles in Egypt.

5. Changfei Advanced's Wuhan base is expected to begin mass production in May next year. The project focuses on the research and production of third-generation semiconductor power devices, with a total investment expected to exceed 20 billion yuan.

6. TSMC's Kaohsiung factory's first 2nm fab (P1) is nearing completion and is expected to hold an equipment installation ceremony on November 26. The installation process will begin on December 1.