International News:

1. On June 2nd, NVIDIA announced the launch of the Blackwell Ultra AI chip in 2025 and revealed that the next generation AI platform, named "Rubin," will be released in 2026.

2. Samsung Electronics is exploring "hafnium-based ferroelectric" as the next-generation NAND flash memory material. They plan to exceed 1,000 layers for their 3D NAND around 2030.

3. The 2024 Semiconductor Wafer Test Conference will be held in California, USA from June 3rd to 5th. This conference will focus on microelectronic wafer and chip-level testing, including 23 presentations on semiconductor technology.

4. Microsoft plans to invest $3.2 billion in Sweden to build data centers focused on artificial intelligence (AI) and cloud services.

5. Kinghelm (www.kinghelm.net) and Slkor's official website have released "Empowering New Quality Productivity with AI" by Song Shiqiang, which has been republished by several media outlets including Xinhua Liaowang.

6. South Korean semiconductor equipment manufacturer Yesty announced that it has received orders from Samsung Electronics worth 60 billion Korean won (approximately $43.5 million) for high-bandwidth memory (HBM) pressing equipment and ambient pressure equipment.

China News:

1. On May 31st, the management committee of the Texas Tianqu New Area signed an investment agreement with Guangdong Xindaixi Materials for the industrialization project of semiconductor laser radar and sensor components, which officially settled in the new area.

2. On May 30th, Guangdong Xincheng Hanqi Semiconductor successfully acquired the plot 2024WT038 in Songshan Lake Ecological Park, which is intended for a wafer-level advanced packaging and testing manufacturing project, with a total investment of approximately 3.09 billion yuan.

3. On May 30th, the signing ceremony and unveiling of the joint semiconductor materials laboratory co-built by China-Singapore International Joint Research Institute and Guangzhou Weinaxin Materials was held at the research institute.

4. UMC is actively developing the 12nm FinFET process technology platform (12FFC), which can be widely used in various semiconductor products. It is expected to be developed by 2026 and put into mass production by 2027.

5. The Zhangjiang Chip Testing Public Service Platform is about to be launched. The platform, jointly created by Zhangjiang High-Tech and Hualing, will accelerate the speed of chip production from design to mass production.

6. On May 28th, Taiwan Semiconductor passed the plan for the business separation of the 8-inch GaN (gallium nitride) business, which will be taken over by its subsidiary, Guanya Semiconductor.