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AI startup Etched has launched a new Transformer ASIC named "sohu," claiming it is 20 times faster than Nvidia's H100 GPU

release time:2024-07-03Author source:SlkorBrowse:4002

International News:

1. OpenAI's API is currently available in 161 countries and regions, excluding Mainland China and Hong Kong.

 

2. The Tensor G5 chip, expected to be used in Google's flagship smartphones next year, will be based on TSMC's 3nm process and has successfully entered the tape-out stage.

 

3. OpenAI's CTO, Mila Murali, stated that GPT-5, expected to be released in a year and a half, will possess "PhD-level" intelligence, describing the leap from GPT-4 to GPT-5 as going from a high school student to a PhD student.

 

4. Semiconductor manufacturer Nexperia will invest $200 million to develop and produce next-generation silicon carbide and gallium nitride semiconductors in Hamburg, increasing wafer capacity for diodes and transistors.

 

5. Qiu Huilin, Director of International Trade at Sakow Micro, attended the Thailand International Machinery Manufacturing Exhibition to strengthen interaction with the Southeast Asian market and promote the internationalization of SLKOR and Kinghelm.

 

6. AI startup Etched has launched a new Transformer ASIC named "sohu," claiming it is 20 times faster than Nvidia's H100 GPU.



China News:

1. Huawei insists on not entering the automotive industry, transferring the "Wanjie" trademark to Siles, totaling 2.5 billion yuan.

 

2. The 3C6000 series processors for servers from Loongson have returned samples, with overall test results meeting expectations, planned for release in the fourth quarter of 2024.

 

3. The 10th China OLED Industry Development Forum (CIOF) was held on July 3rd at Meeting Room M37, Shanghai New International Expo Center.

 

4. On July 1st, UBTECH Beijing partnered with FAW-Volkswagen to explore the deep application of humanoid robots in industrial scenarios.

 

5. On June 30th, Huatian's subsidiary, Jiangsu Pangu Semiconductor, started construction on a multi-chip high-density board-level fan-out packaging industrialization project, with a total planned investment of 3 billion yuan.

 

6. On July 1st, Shanghai Guona Semiconductor's Haining production base held a grand commissioning ceremony.

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