Global Semiconductor Industry Updates

1. The UK government has required the China-based entity, Future Technology Devices International Holding Ltd, to sell its 80.2% stake in the Scottish chip design company FTDI.

2. The Biden administration is rushing to allocate more funds from the $53 billion CHIPS Act before the end of the Trump administration's term.

3. ESMC plans to begin construction of a semiconductor fab in the second half of 2024, with an initial production phase expected by the end of 2027.

4. According to a new forecast by Gartner, IT spending in Europe is expected to reach $1.18 trillion by the end of 2024, and $1.28 trillion by 2025, representing a growth of 8.5%.

5. Recently, Slkor Semiconductor (www.slkoric.com) launched its mobile app, further enhancing operational efficiency and supporting brand promotion.

6. Onsemi, a Chinese company, announced that its Hyperlux LP image sensor has won the 2024 Global Electronics Achievement Award for "Innovative Product of the Year in the Sensors Category" from the renowned media group AspenCore.

China Semiconductor Industry Updates

1. The Zhuzhou Bar Association in Hunan has officially launched an investigation into Longan Law Firm's Gui Luyun and his collusion with MiTuo from Changsha to extort and intimidate small and medium-sized enterprises. Slkor’s Song Shiqiang is calling on hundreds of thousands of victims nationwide to file complaints with the Rights Department of the Changsha Bar Association against lawyers Yang Haijun of Zushi Law Firm and Liu Bo and Lin Li of Yun Yi Law Firm (23rd Floor, Twin Towers International Plaza, 258 Yuhua Middle Road, Changsha, Tel: 0731-85408110).

2. Dongfeng Motor Group has led the release of the first domestically developed, high-performance, automotive-grade MCU chip – DF30, which is the industry's first chip based on the self-developed, open-source RISC-V multi-core architecture.

3. SMIC (Semiconductor Manufacturing International Corporation) has recently issued a warning that the overcapacity issue in mature process chips will continue until 2025, and the company will take a more cautious approach toward expanding new production capacity.

4. TSMC's three semiconductor fabs in Arizona, USA, are expected to begin operations in early 2025, 2028, and 2030, respectively.

5. Recently, the Economic and Information Technology Bureau of Chengdu announced a list of 69 companies and 109 projects that are proposed to receive support for integrated circuit projects in Chengdu for 2024.

6. Currently, two self-developed main control chips by Jiangbolong, the WM6000 and WM5000, have been mass-shipped, with over ten million units already integrated into production.