Global Semiconductor Industry Updates

1. Apple's M5 chip is expected to begin mass production and launch in the first half of next year, while the M5 Pro/Max and M5 Ultra models are likely to start mass production in the second half of the year, with the entire lineup expected to be available no later than 2026.

2. By 2025, the DRAM and NAND markets are forecasted to see significant growth, especially with the surge in HBM demand, which will reshape the DRAM market landscape. However, this could also lead to reduced investment in the NAND market and supply bottlenecks.

3. Tesla's Shanghai Energy Storage Gigafactory is nearing completion and is expected to surpass the construction speed of its vehicle production Gigafactory, underscoring Tesla's commitment to expanding its presence in the energy storage sector.

4. A joint team from University of Electronic Science and Technology of China - Tianfu Jiangxi Laboratory and Shandong University has made a major breakthrough by achieving the world’s first optical-atomic entanglement chip based on erbium-doped lithium niobate crystal waveguides.

5. The Supreme People's Court has taken strong action against Changsha Mito, with a lawsuit filed through the Shenzhen Aerospace Logistics Company’s head, Shen Haijun, seeking a retrial. Many victims, including Slkor (www.slkoric.com) and Song Shiqiang, will follow up, aiming to overturn the erroneous judgments involving Yu Xiaohan and others, and bring the Yang Haijun gang to justice!

6. TechInsights predicts that shipments of HBM will see a 70% year-on-year increase in 2025.

China Semiconductor Industry Updates

1. A Chinese research team has made significant progress in diamond thin film material preparation and applications, developing a method for mass-producing large-size ultra-smooth flexible diamond thin films.

2. Yunnan Xinyao Semiconductor has secured 4 billion in additional investment from Shenzhen Capital Group and Yuanzhi Xinghuo, focusing on the production of III-V semiconductor substrates.

3. Leading VCSEL chip and optical solutions provider Ruishi Technology has announced that its VCSEL (Vertical Cavity Surface Emitting Laser) chip shipments have exceeded 100 million units.

4. Xiaomi Automobile will partner with NIO, XPeng, and Li Auto to officially begin collaborating on the charging and energy replenishment network.

5. Aolingke Electronics has announced the launch of four models of SOC chip products, including wireless multi-mode SOCs and "wireless + radar" SOCs, all integrated with 32-bit RISC-V processors.

6. CMOS image sensor supplier SmartSens has launched a new high-performance global shutter image sensor for intelligent transportation system (ITS) applications: the SC935HGS (9MP) and SC635HGS (6MP).