International News:

1、Samsung Electronics has announced the liquidation of its Slovakian subsidiary due to various factors, ending its 16-year operation in Europe.

2、AMD has invested $4.9 billion to acquire server manufacturer ZT Systems.

3、Samsung is reducing the number of next-generation high-NA EUV lithography machines it will import, and its joint research center with ASML is facing difficulties.

4、Dutch electronics giant Philips and Thales have agreed to cancel the jury trial after Philips dropped its FRAND patent litigation against Thales.

5、GoPro plans to cut approximately 15% of its workforce to reduce operating expenses by about $50 million in 2024.

6、Spain is seeking to collaborate with partners such as Taiwan to actively advance its €12 billion semiconductor development plan.

China News:

1、Suzhou Ruisheng Juchuang has secured nearly 100 million yuan in its first round of financing. The focus will be on semiconductor vacuum pumps, with initial research and testing underway.

2、Awei Electronics has launched a new generation SPDT RF switch, the AW13012TDNR, which features low insertion loss, high isolation, and rapid switching. It is suitable for Wi-Fi, UWB, and NR Redcap RF front-ends.

3、SLKOR semiconductor has strongly countered the infringement claims against Changsha Mitou, urging victims to use legal measures to protect their rights.

4、Feiwotai has developed a nano-coating that addresses pressure and corrosion resistance issues in electric drive systems, providing strong protection for core components in new energy vehicles.

5、Jinghe Integration and Sistewai have jointly launched the first 180-megapixel full-frame CIS chip, successfully breaking Sony's long-standing monopoly in the ultra-high-pixel full-frame CIS market.

6、Chipone Microelectronics has exported its MLF series equipment to Japan for the first time, marking a solid step in its global strategy.