Global Semiconductor Industry Updates

1. China has officially launched the "International Cooperation Group of Friends for Artificial Intelligence Capability Building" at the United Nations.

2. TSMC is in talks with NVIDIA to produce Blackwell AI chips at TSMC's new factory in Arizona, USA.

3. VSMC's first wafer fab has begun construction, with a total investment of approximately $7.8 billion, and production is expected to commence in 2027.

4. SK hynix’s standard HBM4 will continue to use N12FFC+ base wafers, while custom products will upgrade from 5nm to 3nm. The base wafers are expected to improve performance by 20% to 30%.

5. Kinghelm (www.kinghelm.com.cn) and Slkor's viral article, "Young Mindset, Committed to Excellence — Interview with Kinghelm's Electronics Consultant Professor Zhang Wujun," has been widely shared across the internet, with total views easily surpassing one million! Among them, Xinjiang Online has reached 278,000 views.

6. Marvell has reached a five-year partnership agreement with Amazon AWS, covering a wide range of Marvell's data center semiconductor products.

China Semiconductor Industry Updates

1. The ongoing extortion cases involving Mituo continue to be heard in various courts across the country, with dozens of new cases each day. Therefore, the victims of previous misjudgments by the Supreme Court's Yu Xiaohan and others must continue to fight for justice in court. Slkor's Song Shiqiang, Hao Yi, and Jin Wang Han Sheng have published five key strategies for responding to Mituo's extortion trials!

2. This year's He Liang He Li Foundation Awards have been presented to 56 scientists, with six recipients from Shanghai recognized for their significant achievements in fields such as life health, civilian aircraft design, and chip storage technology.

3. The Shanghai Integrated Circuit Industry Development Forum and the 2024 China Integrated Circuit Design Exhibition (ICCAD 2024) will be grandly held at the Shanghai World Expo Exhibition Hall on December 11-12.

4. The 2024 Advanced Packaging Technology and Materials Forum will be held in Suzhou on December 25-26.

5. The topping-out ceremony for Chipstar Semiconductor's 6-inch RF chip production capacity expansion project was successfully held.

6. Guangyang Co., Ltd. plans to build a project in Anhui with an annual production capacity of 60 million sets of high-end precision components for new energy vehicles and robots. The total investment in the project is expected to be 1 billion RMB.