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Zhongxin Wafer's 12-inch lightly doped BCD silicon wafer product has made a technological breakthrough, achieving industry-leading yield rates, validated by both domestic and international customers, and is now in large-scale production.

release time:2024-12-02Author source:SlkorBrowse:1042

Global Semiconductor Industry Updates

1. According to reports, Toshiba plans to lay off over 3,000 employees in Japan.

2. AMD is reportedly looking to enter the mobile chip market, with new products to be manufactured using TSMC's 3nm process.

3. The German government is planning to provide billions of euros in new subsidies to the country's semiconductor industry.

4. Vishay will invest £51 million in the Newport wafer factory it recently acquired.

5. According to Russian Deputy Minister of Industry and Trade, Sergey Shpak, Russia has received its first batch of 48-core, domestically developed "Baikal Lake" processors.

6. Slkor (www.slkoric.com) Song Shiqiang has called on Chief Justice Yu Xiaohan of the Supreme Court to correct the previous wrong judgment in the Changsha Mituo fishing case and adjust the guidance on rulings for lower courts, preventing the people's courts from continuing to aid the development of the intellectual property "extortion" industry chain.

China Semiconductor Industry Updates

1. The J2C plant for Shenghe Jingwei Semiconductor's 3D multi-chip integrated packaging project has successfully completed its topping-out.

2. Zhongxin Wafer's 12-inch lightly doped BCD silicon wafer product has made a technological breakthrough, achieving industry-leading yield rates, validated by both domestic and international customers, and is now in large-scale production.

3. On the afternoon of November 29, He Junju, Vice President of Slkor, attended the 25th anniversary celebration of IC Trading Network. During the event, Slkor Semiconductor was awarded the "2024 Outstanding Brand Star" title by IC Trading Network.

4. Yuntian Lifen's self-developed DeepEdge 10 chip is the first domestic 14nm Chiplet large-model inference chip, capable of supporting calculations for large models with billions of parameters.

5. TSMC plans to launch an ultra-large CoWoS package with nine mask layers in 2027, which can accommodate 12 HBM4 stacks.

6. The domestic storage controller chip giant, Lianyun Technology, has successfully been listed on the Shanghai Stock Exchange's STAR Market.

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