Global Semiconductor Industry Updates

1. U.S. AI chip startup Tenstorrent has reached an agreement with the Japanese government to train up to 200 chip engineers at its U.S. office over the next five years.

2. Power Integrations has launched a 1700V Gallium Nitride (GaN) switch IC, setting a new benchmark for GaN technology.

3. Lattice Semiconductor is restructuring and will lay off approximately 125 employees, or 14% of its workforce.

4. The U.S. semiconductor industry is accelerating adjustments to its supply chain strategy, gradually excluding Chinese companies from the supply chain.

5. GlobalFoundries has been fined $500,000 for violating export regulations by shipping over $17 million worth of wafers to SJ Semiconductor, which was on the U.S. Entity List managed by the Bureau of Industry and Security.

6. Bosch, the world’s largest automotive parts supplier, is also feeling the pressure and will lay off 7,000 workers at its factories.

China Semiconductor Industry Updates

1. The 21st China International Semiconductor Expo (IC China 2024) will be held on November 18 at the National Convention Center in Beijing.

2. China’s first national standard in the field of organ-on-a-chip technology, GB/T 44831-2024, "General Technical Requirements for Skin Chips," has been officially released.

3. A team sent by Sako Microelectronics to Changsha has uncovered shocking information: Dreamweaver (Zhimeng) Company made two trips to Changsha to learn fishing and scam techniques from Mituo. A 4-minute phone recording of Nie Gang has been exposed, and relevant evidence has been collected for judicial proceedings!

4. As U.S. semiconductor companies continue to suppress the mainland Chinese semiconductor sector, Taiwanese equipment suppliers like Jingding, Ruiyun, and Fanxuan are expected to benefit from order shifts.

5. Horizon Robotics has won the "Best Partner Award" from BYD, becoming the only intelligent driving solution provider to receive this honor.

6. Yuntian Semiconductor has made a technological breakthrough in optoelectronic co-packaging processes, enabling support for a variety of technology paths, including VCSEL, DML, EML, silicon photonics, and lithium niobate-based optical modules.