International News:

1. In 2023, Chinese automakers sold 112,000 vehicles in Southeast Asia, a year-on-year increase of 3.35%. The primary source of this increase is electric vehicles.

2. Wen Qiyi, Vice President of SK Hynix, stated at an academic conference that Chiplet technology will be applied to DRAM and NAND products within 2-3 years.

3. The U.S. Department of Commerce will provide HP with $50 million in direct funding under the CHIPS and Science Act to support the expansion and renovation of HP's factory in Oregon.

4. Starting October 1, Canada will impose a 100% tariff on electric vehicles imported from China. This new additional tax will be levied on top of the existing 6.1% tariff.

5. On August 29, the open letter from Kinghelm and SLKOR’s Song Shiqiang, titled "An Open Letter to the Victims of Mito Fishing Rights," was re-shared by hundreds of media outlets, including Hong Kong Satellite TV and China Business News Network, calling for greater unity to combat fraudulent rights protection claims.

6. Qualcomm Incorporated will acquire Sequans’ 4G IoT technology to strengthen its industrial IoT product portfolio.

China News:

1. Shanghai Suiruan Technology Co., Ltd. has officially launched its A-share IPO process. The company, primarily engaged in the development of cloud computing products in the field of artificial intelligence, is valued at 16 billion RMB.

2. According to Digitimes, TSMC is expected to achieve revenue exceeding 1 trillion New Taiwan Dollars (about $31 billion or 223.7 billion RMB) in three quarters, solely based on its 3nm and 5nm processes.

3. As the U.S., Japan, and the Netherlands have tightened export controls, Chinese companies imported chip manufacturing equipment worth approximately $26 billion from January to July this year, surpassing the highest value of 2021.

4. On August 28, the groundbreaking ceremony for Quanxin Microelectronics' semiconductor high-end equipment R&D and manufacturing base was successfully held, marking a new development stage for Quanxin Micro in the field of large-scale integrated circuits.

5. On August 26, the Atomic Semiconductor project was officially signed. This project is the first to be settled under Hong Kong’s "Industry-Academia-Research 1+ Plan" in Wuxi.

6. Recently, Hubei Anxinmei Semiconductor’s packaging and testing project has officially begun trial production. The total planned investment for the project is 2.1 billion RMB, to be implemented in three phases, with an estimated annual output value of 2.5 billion RMB once fully operational.