International News:

1. During the 9th Trilateral Summit between China, Japan, and South Korea, Premier Li Keqiang met with Lee Jae-yong, Chairman of South Korea's Samsung Group, stating a commitment to becoming a company that Chinese people love.

2. On May 28th, Nvidia's stock surged nearly 7%, reaching another historic high with a market capitalization exceeding $2.8 trillion, trailing Apple's market cap by approximately $100 billion.

3. As of May 2024, the list of the top ten global R&D investors has been released, with only one Chinese company, Huawei, making the list, ranking seventh with an R&D investment of $23.5 billion.

4. On May 30th, chip design company Arm unveiled new CPU and GPU IP based on 3nm chip technology.

5. On May 30th, articles titled "Insights from Song Shiqiang: Efficiency in Enterprise Management (Part II)" were published on the official websites of Kinghelm (www.kinghelm.net) and Slkor Semiconductor, and were subsequently shared by multiple media outlets.

6. The Nuclear Safety and Security Commission (NSSC) of South Korea announced on May 29th that they are investigating an incident where two employees at Samsung Electronics' Giheung plant were exposed to radiation on May 27th.

China News:

1. China is expected to invest around 6 billion yuan in the research and development of solid-state batteries, with six companies including CATL, BYD, FAW, and SAIC potentially receiving government support for basic research and development.

2. The 6th Shenzhen Semiconductor Industry Technology Summit will be held on June 26th at Hall 8 of the Shenzhen International Convention and Exhibition Center (Bao'an New Hall).

3. Analysts from the China Industrial Research Institute predict that the sensor market in China will reach 332.49 billion yuan in 2023 and 373.27 billion yuan in 2024.

4. BYD has unveiled its fifth-generation DM (Dual Mode) technology, which integrates industry-leading chips, achieving a 146% increase in chip computing power by integrating VCU and dual MCUs into a single system.

5. The first phase of the high-end substrate project for integrated circuit packaging at Chiplove Technology (Nanjing) has been completed and accepted. With a total investment of 4.5 billion yuan, the project is estimated to have an annual output of 1.45 million pieces.

6. The semiconductor industry is continuously exploring new materials and advanced manufacturing technologies. For instance, Slkor's silicon carbide (SiC) belongs to the third generation of semiconductors and is currently the most advanced material in use.