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NEO Semiconductor has unveiled its revolutionary "3D X-AI Chip," a significant advancement in 3D DRAM and NAND memory technology

release time:2024-08-20Author source:SlkorBrowse:4980

International News:

1. CINNO Research recently reported that China will lead the global OLED market by area this year.

 

2. NEO Semiconductor has unveiled its revolutionary "3D X-AI Chip," a significant advancement in 3D DRAM and NAND memory technology.

 

3. The 2024 Global AI Chip Summit (GACS 2024) will be held on September 6-7 at the Crowne Plaza Beijing, New Yunnan.

 

4. TSMC has yet to produce a chip since announcing its Arizona facility in 2020.

 

5. Wang Yaqing was recognized as an excellent summer intern by Kinghelm and SLKOR, receiving a 1,000 yuan award from Mr. Song Shiqiang.

 

6. The U.S. Department of Commerce has signed a preliminary agreement with Texas Instruments to provide $1.6 billion in grants and $3 billion in loans under the CHIPS Act.


China News:

1. Shenzhen has announced the creation of 10 AI clusters, including locations like Shenzhen Bay, Futian, and Longgang.

 

2. China's Crystal Integration and STMicroelectronics have successfully trialed the industry's first 180-megapixel full-frame CIS chip, marking a major breakthrough in high-end image sensors.

 

3. The STM32 Nationwide Tour seminar is scheduled from September 3 to 13, 2024.

 

4. Elexcon 2024, Shenzhen International Electronics Show, will open from August 27 to 29 at the Shenzhen Convention and Exhibition Center (Futian).

 

5. The Shanghai Integrated Circuit Equipment R&D and Manufacturing Base project plans to invest up to 1.698 billion yuan with a construction period of 24 months.

 

6. Ganfeng Lithium will establish a long-term strategic partnership with Yigit Aku to expand their business in Turkey and globally.

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