Global Semiconductor Industry Updates

1.Samsung accelerates its HBM investments and expands packaging capacity at its Suzhou facility.

2.Japanese manufacturer Kioxia has received approval for an IPO on the Tokyo Stock Exchange and will list on the TSE Prime market on December 18, with an estimated market value of ¥750 billion.

3.The U.S. allocates $285 million to establish a semiconductor digital twin center.

4.The U.S. CHIPS Act allocates $300 million to support three advanced packaging projects in Georgia, California, and Arizona.

5.Israeli semiconductor foundry Tower Semiconductor announces that its latest silicon photonics platform, featuring 1.6Tbps optical transceivers, has entered mass production.

6.The case of the Changsha Mituo scam gang shamelessly harassing victims in court is now over, with attendees calling the police during the trial to have Mituo and its representatives arrested and prosecuted.

China Semiconductor Industry Updates

1.In response to the U.S. GPU export ban, market rumors suggest that Hong Kong-based graphics card manufacturer PC Partner will relocate its operations to Singapore, establishing PC Partner Singapore PTE Ltd.

2.China's foundries continue to expand, with South Korea's exports of semiconductor photomasks to China reaching $16.96 million from January to October.

3.Slkor ranks first on Lichuang Mall’s authorized agent list, competing alongside global brands such as Nexperia, ON Semiconductor, Panasonic, and Holtek!

4.Naxin Micro and Xinqian Semiconductor launch the NS800RT series real-time control MCU.

5.BYD responds to investment and cooperation rumors with NIO, calling them completely false.

6.Starry Meizu, in collaboration with Shenzhen Tong, begins pilot testing of UWB-based contactless secure payment technology, ushering in a new era of frictionless payments.