International News:

1. The Singaporean government has set a target to achieve a 50% increase in manufacturing, predominantly driven by the semiconductor industry, by 2030. Many major chip manufacturers are investing heavily to ramp up production capacity.

2. The European Union is making significant investments in promoting chip independence through the RISC-V open-source architecture initiative, led by the Barcelona Supercomputing Center.

3. In relation to China, the United States released a 165-page draft on the 21st proposing restrictions or bans on Chinese investments in AI and other technology sectors. These investment restrictions could be enforced by the end of this year.

4. In the first quarter of 2024, Huawei saw a dramatic 70% increase in smartphone sales in mainland China, capturing a market share of 17%, reclaiming the top spot in rankings after 13 quarters.

5. Song Shiqiang, Managing Director of Kinghelm (www.kinghelm.com.cn) and Sarko Micro, released "Shenzhen Huaqiangbei - A Comprehensive Study in 19 Points," providing a systematic, professional, and in-depth analysis of Huaqiangbei.

6. Japan has announced new sanctions targeting "individuals and entities supporting Russia in the Ukraine conflict." Reports indicate that sanctioned Chinese companies "provided drone chips to Russia."

China News:

1. On June 21st, the Ministry of Industry and Information Technology (MIIT) published the "2024 Automotive Standardization Work Points," emphasizing the strengthening of automotive chip standard supply. Core components like automotive chips are expected to enter a period of rapid development.

2. The 2024 Computing Power Technology Innovation and Development Ecology Conference will be held on July 8th at the Shanghai New International Expo Center, C1 Hall, Forum Area 1574.

3. On June 21st, the Jiangsu Integrated Circuit (Wuxi) Industry Special Fund was established in Wuxi with a total scale of 5 billion RMB.

4. According to a report by the China Industrial Research Institute, the market size of automotive chips in China is predicted to reach 90.54 billion RMB in 2024.

5. Chipbond Technology plans to acquire the remaining 72.33% equity of its subsidiary, Chipbond Vietnam, making Chipbond Vietnam a wholly-owned subsidiary. This move aims to lead innovation in China's power semiconductor industry.

6. TSMC is researching a new advanced chip packaging method that uses rectangular panel-like substrates instead of traditional round wafers. This innovation allows for more chips to be placed on a single substrate.