International News:

1. Intel and AWS will jointly invest in a custom chip for artificial intelligence computing, known as the Fabric chip, under a multi-year, multi-billion dollar framework.

2. The Polish government will provide over 7.4 billion zloty (approximately 13.568 billion RMB) in subsidies for Intel's advanced packaging factory construction project in Wrocław, Poland.

3. The U.S. Department of Commerce has released a new proposal aimed at banning connected and autonomous vehicles from using software and hardware sourced from China on U.S. roads.

4. The European Second Court of Justice has confirmed the EU's antitrust fine against U.S. chip manufacturer Qualcomm, reducing the fine from the initial 242 million euros to 238.7 million euros (approximately 1.88 billion RMB).

5. Kinghelm Electronics and the General Manager of SLKOR, Song Shiqiang, were awarded the Sharing Star Award at the "2024 Chip Growth" forum held at the Huaqiangbei Hotel.

6. General Motors is negotiating with Japan's TDK to procure batteries for its plants in the U.S., while TDK has been authorized by CATL to produce lithium iron phosphate batteries using its technology.

China News:

1. The Ministry of Industry and Information Technology, the National Development and Reform Commission, the Ministry of Finance, and the State Taxation Administration have deployed work on creating a list of integrated circuit companies that will benefit from the additional deduction policy for 2024.

2. Recently, the Ministry of Industry and Information Technology announced the release of the "Guidance Catalogue for the Promotion and Application of Major Technological Equipment (2024 Edition)."

3. Recently, Unisoc completed a 4 billion RMB equity financing, which has been termed the largest financing event in China's semiconductor sector in 2024.

4. The Chongqing San'an project (which is an 8-inch silicon carbide substrate supporting factory) has achieved operational readiness for the substrate factory.

5. The V-generation IGBT chips and FRD chip-packaged electric vehicle main motor drive modules developed independently by Silan Microelectronics have begun mass supply to downstream manufacturers such as BYD, Geely, GAC, Leapmotor, and Inovance.

6. Recently, Huahai Qinke's 12-inch ultra-precision wafer thinning machine, Versatile-GP300, has completed its first verification work.