International News:

1. Samsung Electronics has secured a 2nm process advanced manufacturing order to produce ADAS chips for U.S. semiconductor company Ambarella, expected to tape out in 2025 and plan for mass production in 2026.

2. Israel's Tower Semiconductor and India's Adani Group plan to invest $10 billion to build a semiconductor manufacturing facility near Mumbai, aiming to produce chips needed for drones, automobiles, and other equipment.

3. Apple officially released the A18 Pro chip, manufactured using TSMC's new N3P 3nm process, which will debut in the iPhone 16 Pro/Max models.

4. Panasonic's subsidiary, Panasonic Energy, has completed preparations for the mass production of 4680 cylindrical power batteries, with the renovated Wakayama factory becoming the main production site for these batteries.

5. On September 18, SLKOR Semiconductor faced a court hearing in the Guangdong Provincial High Court regarding an appeal related to a fishing-related case with Changsat Mitto.

6. AI companies OpenAI and Anthropic have agreed to submit their new models to the U.S. government for safety assessments before release, ensuring safety and reducing potential social risks.

China News:

1. Hanlei Technology has signed a strategic cooperation agreement with GlobalWafers to jointly promote the technological R&D and manufacturing of 8-inch SiC wafers in the compound semiconductor sector.

2. ChipOn has completed the product process integration for SAW filter wafer manufacturing and wafer-level packaging, forming a scalable and expandable capacity layout for SAW filters.

3. Geely Automobile's subsidiary, Volvo Cars, has canceled its goal of achieving 100% electrification by 2030, citing customer hesitation towards fully electric vehicles.

4. The Jiading District Integrated Circuit Industry Chain Alliance has been established, which will serve as an important tool for extending, supplementing, and strengthening the integrated circuit industry chain, promoting high-quality development in the sector.

5. The SAIC Chip Engineering Center has signed agreements with 12 leading companies in the automotive chip industry chain, including SAIC Group and GAC Research Institute, to accelerate the localization process of automotive chips.

6. The Shanghai Integrated Circuit Design Industry Park's Project 4-2 (Jiding Tiandi) has been completed and delivered, aiming to focus on breakthroughs in key core technologies and significant industries.