Global Semiconductor Industry Updates

1. ON Semiconductor has reached an agreement to acquire Qorvo's Silicon Carbide Junction Field-Effect Transistor (SiC JFET) technology business and its subsidiary United Silicon Carbide for $115 million in cash.

2. China Mobile Research Institute has announced major breakthroughs in hollow-core optical fiber and transmission systems, which are expected to reshape the global development landscape of optical communication technology and industry over the next fifty years.

3. Japan's Ministry of Economy, Trade, and Industry (METI) will provide subsidies for the Silicon Carbide (SiC) semiconductor project jointly invested by Denso Corporation and Fuji Electric, with the subsidy amount reaching up to 70.5 billion yen (approximately 3.4 billion RMB).

4. Vishay Intertechnology Inc. will invest £51 million in the Newport Wafer Fab foundry located in Wales, UK. This investment is supported by a £5 million subsidy from the Welsh government.

5. On the evening of December 13 at 7:30 PM, Slkor's Song Shiqiang and Dr. Kelu Yong from Tanjing, along with Murong Sujuan, editor-in-chief of Chip Talk, held a live-stream discussion on "The Escalating US-China Tech War, China's Chip Crisis, and the Response." The live stream lasted over an hour, with the average viewing time of online viewers increasing by more than 200% compared to the previous session!

6. Mitsubishi Electric Group will invest approximately 10 billion yen (around 480 million RMB) to build a new power semiconductor module packaging and testing plant in Fukuoka Prefecture, Japan, with operations expected to begin in October 2026.

China Semiconductor Industry Updates

1. Members of the infamous extortion gang from Changsha Mito Fishing, notorious for their criminal activities, have become increasingly nervous. They wear masks in courtrooms to avoid showing their true identities! Song Shiqiang and Wang Hansheng continue to intensify their efforts in combating and publicizing the issue.

2. The city of Shanghai plans to launch a series of major industry-specific merger and acquisition cases by 2027, aiming to cultivate around 10 internationally competitive listed companies in key sectors such as integrated circuits.

3. The first semiconductor packaging and testing project in Jingmen—Hubei Yaxin Electronics' 35 new packaging and testing production lines—has successfully begun operations in the Dongbao District Electronics and Information Industry Park.

4. CATL and Stellantis are planning to build a joint venture battery factory in Zaragoza, Aragon, Spain, with Stellantis as the primary customer. The total construction period is expected to last four years.

5. The second-phase 12-inch production line at the Huahong Wuxi Integrated Circuit R&D and Manufacturing Base has reached a significant milestone, with wafer production now underway. The total investment in the project exceeds 10 billion USD.

6. The environmental impact assessment (EIA) documents for the construction of a new 180,000-piece annual production line for high-performance automotive-grade fast recovery diode chips by Jiaxing STMicroelectronics Co., Ltd. have been approved and publicly announced.