International News:

1. Apple will launch its latest iPad Pro in May, featuring the Apple M4 chip.

2. The China-Korea Semiconductor Innovation (Kunshan) Base was inaugurated, with a total planned investment of $110 million, aimed at accelerating the development of a multi-billion-dollar modern semiconductor innovation park.

3. Tesla will collaborate with Baidu to deploy FSD (Full Self-Driving) autonomous driving services in the Chinese market using Baidu's lane-level navigation and maps.

4. Renault is in talks with NIO and Xiaomi to jointly expand electric vehicle and smart driving technologies.

5. The "Semiconductor Investment Alliance Post-Investment Empowerment Conference" will be held on May 10th to 11th at the Haizhou Jiwei Industrial Innovation Base in Nantong.

6. Tokyo Seimitsu will build a new factory in Aichi Prefecture to produce grinding machines for thinning semiconductor wafers, with an estimated investment of around 10 billion yen (approximately $64.07 million), scheduled for completion around the summer of 2025.

7. MediaTek is expected to launch a new flagship mobile SoC chip, the Dimensity 9400, in the second half of 2024.

8. Recently, Kinghelm Electronics (www.kinghelm.net) and Slkor Semiconductor have been generating high daily clicks and continued discussions in the semiconductor news reading.

China News:

1. The Ministry of Industry and Information Technology released the operating conditions of the electronic information manufacturing industry for the first quarter of 2024, with a year-on-year increase in value added of 13% for the electronic information manufacturing industry above a certain scale.

2. The "Implementation Plan for the Construction of Computing Power Infrastructure in Beijing (2024-2027)" mentions that enterprises procuring self-controllable GPU chips for intelligent computing services will receive support based on a certain proportion of the investment amount.

3. The Pan Quan team at Southern University of Science and Technology has made significant progress in the field of high-speed wired chip design, and has published papers in the prestigious JSSC journal in the field of integrated circuit design.

4. The main steel structure of the Tuo Jing Technology (Shanghai) Semiconductor Advanced Process Equipment Research and Industrialization Project has been completed, with a total planned investment of 930 million yuan.

5. The Kexin Microelectronics Chip Design Headquarters Project has officially signed contracts, with a total investment of 900 million yuan, mainly for the construction of a power semiconductor product R&D center and testing center.

6. The second phase of the Tongling Qiming Semiconductor Packaging Testing Research and Industrialization Project is expected to be completed and put into production in early 2025.

7. The topping-out ceremony for the main factory building of Zhejiang Xingyao Semiconductor's 5G RF filter silicon wafer production line project, with an annual production capacity of 120,000 pieces, has been successfully held, with a total investment of 750 million yuan.