International News:

1. Intel announced an agreement with Apollo, selling 49% stake in its Ireland-based Fab 34 joint venture for $11 billion.

2. imec and ASML announced the establishment of a joint High-NA EUV lithography laboratory in Veldhoven, the Netherlands, to be operated jointly by ASML and imec.

3. The World Semiconductor Trade Statistics (WSTS) revised its forecast for spring 2024, projecting a 16.0% year-on-year growth in the global semiconductor market. The revised market valuation for 2024 is $6.11 trillion.

4. Mitsubishi Electric's SiC wafer plant in Kumamoto Prefecture, Japan, will commence operations earlier than planned, with the operational start date moved up from April 2026 to November 2025, approximately 5 months ahead of schedule.

5. Kinghelm (www.kinghelm.net) released an article titled "Empowering New Productivity with AI (Artificial Intelligence): Insights from Song Shiqiang."

6. The topping-out ceremony for the main construction of the Fulhua Power Semiconductor Ceramic Substrate Project in Malaysia was successfully held.

China News:

1. Beijing MingJia Semiconductor has achieved a breakthrough in the development and industrial application of wide-bandgap semiconductor gallium oxide materials, with its technical parameters surpassing those of similar international products.

2. The Nanjing Special Gas Production Center project, invested by Baoying (Nanjing) Gas, has commenced construction, aiming to establish Nanjing's first 8,000 tons/year ultra-high-purity ammonia gas (optoelectronic grade) production center.

3. On May 31st, a silicon nitride material project with a total investment of 1 billion RMB successfully signed and settled in Tongxiang. It is expected to achieve an annual output value of 600 million RMB after full production.

4. Hangzhou municipal authorities issued a document aiming to strive for a total scale of the integrated circuit industry in the region to reach 40 billion RMB by 2025.

5. Subsidiaries of Taiwan Semiconductor Manufacturing Company (TSM.N) and NXP Semiconductors (NXPI.O) plan to jointly invest $7.8 billion to build a chip factory in Singapore.

6. At the Taipei International Computer Show, MediaTek announced its move towards 2-nanometer process technology and exploration of advanced packaging technologies such as 2.5D and 3D to facilitate the development of hybrid AI computing.