International News:

1. The United States announced that starting from January 1, 2025, it will double the import tariffs on Chinese semiconductors to 50%.

2. On May 20th, AMD (Advanced Micro Devices), a US company, plans to invest NT$5 billion (approximately RMB 1.122 billion) to establish a research and development center in Taiwan, China.

3. Slkor Semiconductor (www.slkoric.com), a company specializing in AI robotics, has successfully enabled its large-scale model AI robot to respond to English queries, with image recognition functionality actively being debugged.

4. Dutch lithography equipment manufacturer ASML and Eindhoven University of Technology announced a joint investment of €180 million over the next decade for semiconductor research.

5. With the continuous surge in orders for the Xiaomi SU7, Xiaomi's new car delivery target for 2024 has exceeded 100,000 vehicles and is set to reach 120,000 vehicles.

China News:

1. With a total investment exceeding 10 billion yuan, Silean Microelectronics intends to collaborate on the construction of an 8-inch SiC power device chip manufacturing production line project. The project will focus on SiC-MOSEFET as the main product, with a production capacity of 60,000 pieces per month.

2. On May 21st, the signing ceremony for the headquarters project of Zhiju Semiconductor, with a total investment of 5 billion yuan, was held in Jintan. The first phase of the project is scheduled to commence construction in 2024.

3. On May 21st, major wafer foundry United Microelectronics Corporation (UMC) held a groundbreaking ceremony for the third phase expansion of its new factory at Fab 12i in Singapore, with the first batch of machine equipment already delivered to the factory.

4. On May 18th, the signing ceremony for the Aipute Microelectronics chip packaging and testing base project was held in Zhangjiagang, with a planned total investment of 600 million yuan.

5. TSMC is currently continuing its expansion, with plans to build seven new fabs in 2024, including three wafer fabs, two packaging fabs, and two overseas fabs.