International News:

1、Intel is considering selling or transferring part of its self-driving technology division, Mobileye, to the public market or a third party.

2、Vietnam plans to offer incentives for chips, including tax reductions and faster visa processing.

3、Intel announced that its upcoming Lunar Lake and Arrow Lake processor series will not be affected by the recent Vmin Shift instability issue.

4、Qualcomm has launched a new PC processor, the Snapdragon X Plus 8-core processor, which is expected to power AI processes and extend battery life.

5、Israel's Tower Semiconductor and Adani plan to invest $10 billion in a chip project in India.

6、Samsung Electronics and TSMC are collaborating on the development of the next-generation high-bandwidth memory HBM4 for AI chips.

China News:

1、The 2024 Integrated Circuit (Wuxi) Innovation and Development Conference will be held at the Wuxi International Conference Center from September 25-27, 2024.

2、Midea's new air conditioning unit won a gold award at the 2024 IFA exhibition, receiving global recognition.

3、The 2024 “Beautiful Cube Cup” Shenzhen-Chongqing Basketball League opened on September 7, with Kinghelm Electronics as a sponsor and Song Shiqiang attending the opening ceremony.

4、BYD is investing 20 billion yuan to build a high-tech R&D base in Shenzhen.

5、Biren Technology has successfully implemented mixed training technology with three types of heterogeneous GPUs, a first in the industry for supporting the training of a single large model with three or more heterogeneous GPUs.

6、Foxconn Group is considering introducing its advanced packaging technology to the European market and is actively evaluating the feasibility of setting up a semiconductor packaging plant in Europe.