Global Semiconductor Industry Updates

1. Samsung is establishing advanced production facilities at its Hwaseong plant to achieve large-scale production using the 2nm process. The company is also preparing to install equipment for a 1.4nm production line at its Pyeongtaek 2 plant.

2. Intel and AMD will jointly establish an X86 ecosystem advisory group, which will also include participants from Google, Broadcom, Dell, HP, Lenovo, Microsoft, Meta, Oracle, and Red Hat.
3. Japan's Shin-Etsu Chemical plans to expand its core electronics materials division and launch a semiconductor manufacturing equipment business.
4. Qualcomm has released its flagship mobile platform, the Snapdragon 8 Elite, built on a second-generation 3nm process, claiming to be the fastest mobile system-on-a-chip in the world.

5. Slkor's General Manager Song Shiqiang has gained widespread attention online for his article titled “The Supreme People's Court Qualifies Changsha Mitou's Actions as 'Fishing for Rights' Evidence Chain Verification.” Under the pressure from online media, courts at all levels across the country have begun to reduce compensation for Mitou victims or delay case hearings, leading to an improving situation for victims who have been unable to win their cases or escape ongoing litigation.

6. Recently, at the 2024 World Intelligent Connected Vehicle Conference, Beijing Huixi Intelligent Information Technology Co., Ltd. officially launched its first high-level intelligent driving chip, the Guangzhi R1.

China Semiconductor Industry Updates

1. China has launched the world’s largest 35-megawatt six-degree-of-freedom wind turbine test platform at the SANY Renewable Energy Wind Power Testing Center.

2. Hong Kong will establish a HK$10 billion “Innovation and Technology Industry Guiding Fund” to create a mother fund that supports strategic emerging and future industries, including artificial intelligence, robotics, semiconductors, and smart devices.

3. The CRRC low and medium voltage power device industrialization project in Yixing has officially completed its construction and production after 18 months, with an initial investment of 5.9 billion yuan.

4. A new advanced semiconductor packaging and testing base and headquarters project will establish production lines for advanced semiconductor power device chips, with a total investment of 5.2 billion yuan.

5. Recently, the second phase of the Shanghai Semiconductor Equipment Materials Fund, with a total scale of over 2.1 billion yuan, successfully completed its second round of fundraising.

6. Baiwei Storage plans to raise 1.9 billion yuan, primarily targeting key areas such as advanced wafer-level packaging and advanced packaging for memory chips.