International News:

1. SIA Advocacy: John Neuffer, President and CEO of SIA, has urged the House of Representatives to pass the CHIPS for America Act (S.2228).

2. Infineon Breakthrough: Infineon has successfully developed the world’s first 300mm gallium nitride (GaN) power semiconductor wafer technology.

3. Joint Venture in Vietnam: Vietnamese company Tasco has signed an agreement with China’s Geely Automobile Group to establish a joint venture for an automotive assembly plant in Tay Ninh Province, with an estimated total investment of about $168 million.

4. US Battery Initiative: The U.S. Department of Energy announced over $3 billion in funding for 25 selected projects across 14 states to promote domestic production of advanced batteries and battery materials.

5. Controversy in Changsha: Slkor Semiconductor's Song Shiqiang has revealed insights regarding legal issues involving lawyers Yang Haijun and Zhang Yuanyuan, leading to widespread concern among the Mito group in Changsha.

6. Basketball League Results: The 2024 Shenzhen Chuan-Yu Basketball League concluded successfully, with the youth team of the “Chuan-Yu Tongxin Club” and the middle-aged team achieving commendable standings, while the Xichong Chamber of Commerce basketball team won the Best Organization Award.

China News:

1. New Storage Technology: New Storage Technology (Wuhan) Co., Ltd. has garnered significant attention for launching China’s first domestically developed high-capacity 3D storage chip, the NM101.

2. Safety Regulations for EVs: The "Safety Performance Inspection Regulations for Electric Vehicles" (GB/T 44500-2024) have been published, set to take effect on March 1, 2025, focusing on battery and electrical safety.

3. Anti-Discrimination Investigation: The Ministry of Commerce has initiated an anti-discrimination investigation against Canada for its proposed tariffs on electric vehicles and steel/aluminum products imported from China, effective September 26, 2024.

4. Nanjing IC Project: The second phase of the advanced integrated circuit packaging and testing industrial base in Nanjing, led by Huadian, has begun construction, with an investment of 10 billion yuan and an expected annual output value of 6 billion yuan upon reaching full capacity.

5. Silicon Wafer Production Start: Xingan Technology has successfully completed the first batch of silicon wafer production, marking the full operational phase of its wafer factory.

6. Advanced Packaging Project: The groundbreaking ceremony for the Tongfu Advanced Packaging Base project was held in the Shibei High-tech Zone, with a total investment of 7.5 billion yuan, aiming for full production by April 2029.