Global Semiconductor Industry Updates

1. In the first 11 months of this year, China’s integrated circuit exports totaled 1.03 trillion yuan, surpassing the 1 trillion yuan mark for the first time, with a year-on-year growth of 20.3%.

2. China's Ministry of Foreign Affairs has decided to implement countermeasures against U.S. defense companies and senior executives, including 13 companies such as Teledyne Brown Engineering and BRINC Drones.

3. Japan’s Ministry of Economy, Trade, and Industry will provide subsidies for a silicon carbide (SiC) semiconductor project jointly funded by Denso and Fuji Electric. The maximum subsidy amount will reach 70.5 billion yen (approximately 3.4 billion RMB).

4. Vishay Intertechnology Inc. will invest 51 million pounds in the Newport Wafer Fab semiconductor plant in Wales, UK. The investment is supported by a 5 million pound subsidy from the Welsh government.

5. On the afternoon of December 11, Song Shiqiang of Slkor (www.slkormicro.com) and Tanjing Ke Lu Yong, along with Murong Sujuan, the editor-in-chief of Big Talk Chips, held a live discussion on the topic “The Escalation of the China-U.S. Tech War, China’s Chip Crisis and Response.” They all agreed that the situation presents more opportunity than crisis, and that staying calm and focusing on daily work is the key.

6. Mitsubishi Electric Group will invest approximately 10 billion yen (around 480 million RMB) to build a new power semiconductor module packaging and testing factory in Fukuoka Prefecture, Japan. The factory is expected to begin operations in October 2026.

China Semiconductor Industry Updates

1. The "National Anti-Phishing Rights Protection Alliance" gains another powerful ally. Yang Chunlei, the creator of the video channel "Second Uncle Moving Bricks for 20 Years," will continue to expose the fraudulent and extortionate practices of Changsha Mitou through short videos. He calls on victims to refuse settlements and to persist in their appeals while reporting to the authorities in court!

2. TSMC's sales in November this year reached NT$276.06 billion, a 34% year-on-year increase. Analysts believe that the strong demand for AI will drive up TSMC's gross margin potential.

3. The 2024 Slkor (www.slkoric.com) distributor conference will be held on December 12 at the headquarters of Jin Hangbiao/Sako Micro. Several top distributors have been invited to attend and celebrate the occasion.

4. Shenghe Jingwei Semiconductor Co., Ltd.'s 3D multi-chip integrated packaging project at the J2C plant has successfully reached its roof-top completion.

5. Xiamen Anjieli Meiwei Technology Co., Ltd.'s high-end packaging substrate and high-end HDI production capacity construction project has been completed in its first phase and is now in trial operation. The total investment for the project is estimated at 7.38 billion yuan, with construction planned in two phases.

6. TSMC is expected to certify an ultra-large version of its CoWoS (Chip-on-Wafer) packaging technology by 2027. This technology will offer intermediate layer sizes of up to nine mask sizes and support 12 HBM4 memory stacks. It is speculated that it will be adopted by ultra-high-end AI processors between 2027 and 2028.