TVS Diodes vsZener Diodes: Compared to traditional Zener diodes,  TVS diodes have a larger P/N junction area. This structural improvement allows TVS to have stronger high voltage withstand capability while reducing voltage cut-off rate, so it has a better effect on protecting the safety of the low operating voltage loop of the handheld device.
            
           TVS Diodes and Ceramic Capacitors: Many designers prefer to use surface mount ceramic capacitors for ESD protection, which are inexpensive and easy to design, but these devices are relatively weak against high voltages. The impact of 5kV will cause about 10% of ceramic capacitors to fail, and at 10kV, the damage rate reaches 60%, while TVS diodes can withstand 15kV. During the use of handheld devices, due to frequent contact with the human body, each port must be able to withstand at least 8kV contact shock (IEC61000-4-2 standard). It can be seen that the use of TVS diodes can effectively ensure the pass rate of the final product.
   
           TVS diodes and MLVs: Multilayer metal oxide structure devices (MLVs) can also perform effective transient high-voltage surge suppression. Such devices have a nonlinear voltage-current (impedance performance) relationship, and the cut-off voltage can reach 2 ~ 2~ of the initial cut-off voltage. 3 times, this feature is suitable for the protection of lines and devices that are less sensitive to voltage, such as power loops. TVS diodes, on the other hand, have better voltage cut-off factor and lower capacitance, which is very important for high frequency ports of handheld devices, because too high capacitance can affect data transmission, causing distortion or degradation.

          Various surface packages of  TVS diodes are suitable for assembly line requirements, and the chip structure is easy to integrate other functions, such as EMI and RFI filter protection, which can effectively reduce the cost of the device and optimize the overall design.

          Another feature that cannot be ignored is that the diode can be easily integrated with other devices on a chip. There are many devices that integrate functions such as EMI filtering and RFI protection with TVS, which not only reduces the number of devices used in the design and reduces the cost. , and also avoid the accompanying self-inductance that is easily induced when wiring on the PCB board.