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  • Updated: 2022-03-17
  • Views: 5219
The computing amplifier and the comparator are similar in appearance and schematic symbols. If the logo is polished, it is difficult to distinguish between the two. In addition, many beginners often confuse the computing amplifier with the comparator, because in some applications, the operational amplifier is used as a……
  • Updated: 2022-03-17
  • Views: 4874
It is not detailed enough, but there are generally several types of MOS tube fever: 1. The load is overweight, resulting in the flow of MOS tubes. 2. Promote insufficient incentive signals to cause MOS tube to heat up. 3. The incentive signal is too strong, which will also cause the MOS tube to heat up. Generally, the ……
  • Updated: 2022-03-17
  • Views: 5291
Recently, the power electronics are relatively popular, and I will sort out some of the views of some materials. 2022 is a very important year used by Chinese silicon carbide. It is mainly because the 800V system has brought a lot of changes. What are the differences from all levels? I want to discuss with you based on……
  • Updated: 2022-03-17
  • Views: 5325
What is topology? The so -called circuit topology is the connection method of power devices and electromagnetic elements in the circuit, and the design of magnetic components, the design of the closed -loop compensation circuit, and the design of all circuit components depends on topology. The most basic topology inclu……
  • Updated: 2022-03-17
  • Views: 5228
Summary as a power R \\u0026 D engineer, of course, often contacts various chips. Some engineers may not be familiar with the interior of the chip. Many students directly enter the application page of the dataset when applying a new chip, and build an external layout based on the recommended design. That's it. In this ……
  • Updated: 2022-03-17
  • Views: 5038
The circuit of DC-DC is much more complicated than LDO, and the noise is greater. The layout and layout requirements are higher. The quality of Layout directly affects the performance of DC-DC, so it is crucial to understand the Layout of DC-DC. 1. Bad Layout EMI, there will be a higher DV/DT on the foot of the SW tube……
  • Updated: 2022-03-17
  • Views: 4904
Electronic devices are a very complicated system, and the defects and faults during the packaging process are also very complicated. Therefore, research on packaging defects and faults require a systematic understanding of the packaging process so that the cause of defects can be analyzed from multiple angles. The mech……
  • Updated: 2022-03-17
  • Views: 5062
In September 2020, my country clarified the goal of carbon peaks in 2030 and carbon neutrality in 2060. The realization of net zero emissions in the next forty years will be a challenging task for China. For the motor industry, the motor occupies an important position in the industrial field. According to statistics, m……
  • Updated: 2022-03-17
  • Views: 4998
According to statistics, the Chinese market has 300 million two -wheeled three -wheeled electric vehicles. In 2019, my country ’s electric two -wheeled vehicles were 36.09 million vehicles and sold 34.64 million. Heavy user. With the official implementation of the new national standard on April 15, 2019, the sales volu……
  • Updated: 2022-03-17
  • Views: 5289
Study notes for a silicon carbide chip amateur enthusiast. Literature sorting out, industry news, occasionally obtained, the sky is empty. This public account belongs to personal learning notes, only for personal amateur hobbies, and does not involve any business purposes. If there are irregularities in the article, pl……
  • Updated: 2022-03-17
  • Views: 5134
It is widely used in switching power supply, motor control, electric tools and other industries. The gate is a relatively weak link in MOSFET itself. If the circuit design is improperly designed, it is easy to cause the device and even the system to fail. Therefore, this article will organize this article to organize t……
  • Updated: 2022-03-17
  • Views: 5253
Abstract: Traditional power electronic packaging is mainly based on two -dimensional plane packaging technologies such as pheasant connection and lead bonds, which cannot meet the reliable applications of third -generation semiconductor devices in high -frequency, high -voltage, and high temperature. In order to solve ……

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